超薄可重构传感器节点近场电容式标准通信总线的演示

2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Pub Date : 2022-07-10 DOI:10.1109/fleps53764.2022.9781573

Mathias Fayolle, Séverine de Mulatier, R. Delattre, S. Blayac

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引用次数: 0

摘要

本文提出了一种利用串行外设接口(SPI)实现单片机与传感器无线连接的简单有效的方法。传输是通过电容互连完成的。一对电极取代集成电路(IC)之间的欧姆连接。我们的系统适用于超薄电子产品的原型设计和与传感器的可重构接口。介绍了一种微控制器与TC72温度传感器之间的无线通信，误码率为0.4%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Demonstration of near-field capacitive standard communication bus for ultrathin reconfigurable sensor nodes

This paper proposes a simple and effective method to wirelessly connect a microcontroller to a sensor using Serial Peripheral Interface (SPI). The transmission is done using capacitive interconnections. A pair of electrodes replaces the ohmic connection between the Integrated Circuits (IC). Our system is suited for prototyping ultrathin electronics and reconfigurable interfaces with sensors. A wireless communication with a packet error rate of 0.4 % between a microcontroller and a TC72 temperature sensor is demonstrated.

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2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

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