二维网格拓扑下存储转发路由的通用片上网络框架设计

V. Sanju, N. Chiplunkar, Bini Y. Baby
{"title":"二维网格拓扑下存储转发路由的通用片上网络框架设计","authors":"V. Sanju, N. Chiplunkar, Bini Y. Baby","doi":"10.1109/ELECTRO.2009.5441163","DOIUrl":null,"url":null,"abstract":"The need of high performaning, mega functionality solutions are becoming important day by day. The implementation of these mega functional modules which was done using common bus architecture, parallel bus architecture, pipelining are becoming ineffective and posing a bottleneck in terms of performance and throughput in this billion transistor era. To overcome these performance issues, a new paradigm in interconnect technology was proposed. The idea was to implant the concept of data transfer in data communication networks into silicon thus providing advantages of low power scalable high performing architecture with a small increase in die area for routing resources. This paper discusses the design of a generic frame work for network on chip based systems using store and forward strategy.","PeriodicalId":149384,"journal":{"name":"2009 International Conference on Emerging Trends in Electronic and Photonic Devices & Systems","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Design of a generic network on chip frame work for store & forward routing for 2D mesh topology\",\"authors\":\"V. Sanju, N. Chiplunkar, Bini Y. Baby\",\"doi\":\"10.1109/ELECTRO.2009.5441163\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The need of high performaning, mega functionality solutions are becoming important day by day. The implementation of these mega functional modules which was done using common bus architecture, parallel bus architecture, pipelining are becoming ineffective and posing a bottleneck in terms of performance and throughput in this billion transistor era. To overcome these performance issues, a new paradigm in interconnect technology was proposed. The idea was to implant the concept of data transfer in data communication networks into silicon thus providing advantages of low power scalable high performing architecture with a small increase in die area for routing resources. This paper discusses the design of a generic frame work for network on chip based systems using store and forward strategy.\",\"PeriodicalId\":149384,\"journal\":{\"name\":\"2009 International Conference on Emerging Trends in Electronic and Photonic Devices & Systems\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 International Conference on Emerging Trends in Electronic and Photonic Devices & Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ELECTRO.2009.5441163\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 International Conference on Emerging Trends in Electronic and Photonic Devices & Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ELECTRO.2009.5441163","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

对高性能、多功能解决方案的需求日益重要。在这个十亿个晶体管时代,使用通用总线架构、并行总线架构和流水线来实现这些大型功能模块变得无效,并在性能和吞吐量方面构成瓶颈。为了克服这些性能问题,提出了一种新的互连技术范式。其想法是将数据通信网络中的数据传输概念植入到硅中,从而提供低功耗可扩展的高性能架构的优势,同时路由资源的芯片面积也有所增加。本文讨论了基于存储转发策略的片上网络系统通用框架的设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Design of a generic network on chip frame work for store & forward routing for 2D mesh topology
The need of high performaning, mega functionality solutions are becoming important day by day. The implementation of these mega functional modules which was done using common bus architecture, parallel bus architecture, pipelining are becoming ineffective and posing a bottleneck in terms of performance and throughput in this billion transistor era. To overcome these performance issues, a new paradigm in interconnect technology was proposed. The idea was to implant the concept of data transfer in data communication networks into silicon thus providing advantages of low power scalable high performing architecture with a small increase in die area for routing resources. This paper discusses the design of a generic frame work for network on chip based systems using store and forward strategy.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A textile antenna for WLAN applications Phase shifted photonic crystal based filter with flat-top response Design of a generic network on chip frame work for store & forward routing for 2D mesh topology Feasibilty of laser action in strained Ge and Group IV alloys on Si platform High speed LVDS driver for SERDES
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1