超小型器件结构下电流波动的物理机制

N. Sano, K. Natori, M. Mukai, K. Matsuzawa
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引用次数: 3

摘要

通过改变i(通道)区域的长度,对Si - n-i-n结构中的电流波动进行了蒙特卡罗分析,从而覆盖了扩散到准弹道的输运。研究表明,在低偏置区域,电流波动主要由热噪声控制,并在中等大小的器件中直接过渡到热载流子噪声。另一方面,在亚0.1微米的器件结构下,出现了一种新的波动模式。这与i(通道)区域中电子数的波动有关,并且是由从左n(源)区域发射的弹道电子和从右n(漏)区域扩散的电子共同造成的。
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Physical mechanism of current fluctuation under ultra-small device structures
Monte Carlo analyses of the current fluctuation in Si n-i-n structures have been carried out by varying the length of the i (channel) region so that the diffusive to quasi-ballistic transport is covered. It has been demonstrated that the current fluctuation is dominated by thermal noise at low bias regions and makes a direct transition to hot carrier noise in moderately large devices. On the other hand, a new fluctuation mode appears under sub-0.1 micron device structures. This is associated with the fluctuation of the electron number in the i (channel) region and results from both the ballistic electrons emitted from the left n (source) region and the electrons diffused from the right n (drain) region.
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Electrons in semiconductors: how big are they? Wigner paths and boundary conditions for electron transport in open systems with electron-phonon interaction Two-dimensional simulation of negative resistance effects using quantum moment equations Simulation analysis of impurity profile extraction by SCM Physical mechanism of current fluctuation under ultra-small device structures
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