Embedded manifold cooling for efficient thermal management of flexible electronics

The increase in chip integration and the demand for computing power has led to the increasing operating temperature of flexible electronic devices with the increase in power density. The embedded microfluidic cooling has the characteristics of low thermal resistance and efficient heat dissipation. In this study, the embedded microfluid cooling with flexible manifold is firstly proposed and demonstrated to manage the thermal accumulation in flexible electronics working at complex conditions, which can transfer the heat from the high heat flux chips to the peripheral environment or device efficiently, with good bending characteristics and high reliability.