Chronic ankle instability (CAI) refers to the phenomenon of frequent ankle sprain caused by damage to ligaments around the ankle, which has a very high incidence in the sports population with great negative effect on people’s daily life. The physical diagnosis of CAI is mainly based on the degree of ankle ligament relaxation (ALR), but the widely used anterior drawer test (ADT) mainly relies on the experience of doctors and unquantifiable, leading to high incidence of misdiagnosis. In this work, a biomimetic porous graphene-SBR (styrene-butadiene rubber) strain sensor (PGSSS) with a high gauge factor (210), a wide measuring range (90%), and high durability (10,000 stretching cycles) is designed and integrated into a wearable system to monitor, process, transmit, and display ankle skin strain data for ALR analysis in real-time. The PGSSS-based wearable system can accurately monitor ALR, which is of great significance for accurate diagnosis and efficient rehabilitation of patients suffering from CAI.
{"title":"A Wearable Ankle Ligament Relaxation Monitoring System Based on a Porous Graphene Strain Sensor","authors":"Tianrui Cui, Ding Li, Yan-zhang Li, Houfang Liu, D. Jiang, Yezhou Yang, Tian-ling Ren","doi":"10.1109/NEMS57332.2023.10190869","DOIUrl":"https://doi.org/10.1109/NEMS57332.2023.10190869","url":null,"abstract":"Chronic ankle instability (CAI) refers to the phenomenon of frequent ankle sprain caused by damage to ligaments around the ankle, which has a very high incidence in the sports population with great negative effect on people’s daily life. The physical diagnosis of CAI is mainly based on the degree of ankle ligament relaxation (ALR), but the widely used anterior drawer test (ADT) mainly relies on the experience of doctors and unquantifiable, leading to high incidence of misdiagnosis. In this work, a biomimetic porous graphene-SBR (styrene-butadiene rubber) strain sensor (PGSSS) with a high gauge factor (210), a wide measuring range (90%), and high durability (10,000 stretching cycles) is designed and integrated into a wearable system to monitor, process, transmit, and display ankle skin strain data for ALR analysis in real-time. The PGSSS-based wearable system can accurately monitor ALR, which is of great significance for accurate diagnosis and efficient rehabilitation of patients suffering from CAI.","PeriodicalId":142575,"journal":{"name":"2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"115 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123796814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-14DOI: 10.1109/NEMS57332.2023.10190964
Shichang Wang, Jiaying Zeng, Xun Yao, J. Mo
In this work, we report an upconversion fluorescence sensor coupled with microwell device for the ratiometric detection of doxorubicin (DOX). The fabricated microwell device serve to greatly reduce the consumption of samples in the detection. The upconversion fluorescence sensor produces two-emission peaks located at 539 and 654 nm under the excitation of the 808 nm laser. In the presence of DOX, the fluorescence emission of upconversion nanoparticles at 539 nm can be effectively quenched via a fluorescence resonance energy transfer process while that of 654 nm remains unchanged. The fluorescence intensity ratio (F654/F539) shows a linear relationship with the concentration of doxorubicin in the range of 0-100 μM with a detection limit of 2 μM. The proposed detection strategy is simple, fast, accurate, and consumes less samples.
{"title":"An Nd3+-sensitized Upconversion Fluorescence Sensor Coupled with Microwell Device for the Ratiometric Detection of Doxorubicin","authors":"Shichang Wang, Jiaying Zeng, Xun Yao, J. Mo","doi":"10.1109/NEMS57332.2023.10190964","DOIUrl":"https://doi.org/10.1109/NEMS57332.2023.10190964","url":null,"abstract":"In this work, we report an upconversion fluorescence sensor coupled with microwell device for the ratiometric detection of doxorubicin (DOX). The fabricated microwell device serve to greatly reduce the consumption of samples in the detection. The upconversion fluorescence sensor produces two-emission peaks located at 539 and 654 nm under the excitation of the 808 nm laser. In the presence of DOX, the fluorescence emission of upconversion nanoparticles at 539 nm can be effectively quenched via a fluorescence resonance energy transfer process while that of 654 nm remains unchanged. The fluorescence intensity ratio (F654/F539) shows a linear relationship with the concentration of doxorubicin in the range of 0-100 μM with a detection limit of 2 μM. The proposed detection strategy is simple, fast, accurate, and consumes less samples.","PeriodicalId":142575,"journal":{"name":"2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122759263","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-14DOI: 10.1109/NEMS57332.2023.10190974
Xianzheng Lu, Hao Ren
In this paper, we propose an one-port A1N lamb wave resonator utilizing the second-order asymmetric (A2) mode based on a silicon-on-insulator (SOI) substrate. Heavily doped silicon is chosen as the bottom layer, while a vertically arranged double-electrodes design is utilized to compensate for the effective electromechanical coupling coefficient ($mathrm{k}_{mathrm{t}^{2}}$). Finite element analysis (FEA) is used to investigate the resonance mode. After microfabrication and electrical characterization, the Butterworth-van Dyke (BVD) model is used to fit the measured admittance curve to obtain resonance performance. The characterization results show that a $mathrm{k}_{mathrm{t}^{2}}$ of 0.063% and a Q of 522.4 are achieved at a resonant frequency of 774MHz, reporting a high phase velocity exceeding 75000m/s.
{"title":"An One-port A2 Mode AlN Lamb Wave Resonator Based on SOI Substrate","authors":"Xianzheng Lu, Hao Ren","doi":"10.1109/NEMS57332.2023.10190974","DOIUrl":"https://doi.org/10.1109/NEMS57332.2023.10190974","url":null,"abstract":"In this paper, we propose an one-port A1N lamb wave resonator utilizing the second-order asymmetric (A2) mode based on a silicon-on-insulator (SOI) substrate. Heavily doped silicon is chosen as the bottom layer, while a vertically arranged double-electrodes design is utilized to compensate for the effective electromechanical coupling coefficient ($mathrm{k}_{mathrm{t}^{2}}$). Finite element analysis (FEA) is used to investigate the resonance mode. After microfabrication and electrical characterization, the Butterworth-van Dyke (BVD) model is used to fit the measured admittance curve to obtain resonance performance. The characterization results show that a $mathrm{k}_{mathrm{t}^{2}}$ of 0.063% and a Q of 522.4 are achieved at a resonant frequency of 774MHz, reporting a high phase velocity exceeding 75000m/s.","PeriodicalId":142575,"journal":{"name":"2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123028816","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-14DOI: 10.1109/NEMS57332.2023.10190898
Jiaqi Xue, Xiaoyang Zou, Colin Pak Yu Chan, K. Lai
In recent years, the development of flexible and stretchable sensors has shown considerable potential in human information collection for wearable applications. With skin-fitting film electrodes, Electromyography (EMG) signals can be monitored stably and detected for effective control actuation in wearable systems. Traditionally in EMG-based activation, researchers usually focused on the design of EMG features, which is time-costing and difficult to always find the optimal combination. In this work, we have proposed a scheme to use convolutional neural network for complicated EMG feature extraction and accurate force classification. Four force levels were recognized by our model. The experimental result stated that the accuracy in each force level has reached 90.64%, 89.94%, 84.21% and 95.24%, respectively. In addition, the performance of our deep learning model has outperformed the traditional manual-feature-based methods, which utilized mean absolute value (MAV), waveform length (WL) and Willison amplitude (WAMP) for force identification. Actually, this work has verified the excellent effect of intelligent methods in EMG feature learning, and can be further applied in a real-time wearable system to promote its convenience and practicality.
{"title":"The Force Classification Based on EMG Signals for Intelligent Wearable Systems","authors":"Jiaqi Xue, Xiaoyang Zou, Colin Pak Yu Chan, K. Lai","doi":"10.1109/NEMS57332.2023.10190898","DOIUrl":"https://doi.org/10.1109/NEMS57332.2023.10190898","url":null,"abstract":"In recent years, the development of flexible and stretchable sensors has shown considerable potential in human information collection for wearable applications. With skin-fitting film electrodes, Electromyography (EMG) signals can be monitored stably and detected for effective control actuation in wearable systems. Traditionally in EMG-based activation, researchers usually focused on the design of EMG features, which is time-costing and difficult to always find the optimal combination. In this work, we have proposed a scheme to use convolutional neural network for complicated EMG feature extraction and accurate force classification. Four force levels were recognized by our model. The experimental result stated that the accuracy in each force level has reached 90.64%, 89.94%, 84.21% and 95.24%, respectively. In addition, the performance of our deep learning model has outperformed the traditional manual-feature-based methods, which utilized mean absolute value (MAV), waveform length (WL) and Willison amplitude (WAMP) for force identification. Actually, this work has verified the excellent effect of intelligent methods in EMG feature learning, and can be further applied in a real-time wearable system to promote its convenience and practicality.","PeriodicalId":142575,"journal":{"name":"2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128473035","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
With the advantages of high-density integration and strong function, the system-on-wafer (SoW) packaging technology is a promising method, which can meet the requirements of improving system performances in the post-Moore era. However, the high-density integration also leads to a serious heat dissipation problem. This paper presents a cooling system based on fluidic cooling plates for the SoW packaging. The temperature distributions of the dummy chiplets on a wafer and the heat dissipation capacity of the cooling plates with different shapes of the fluidic channels were researched using the finite element method (FEM). The results of the cooling experiments showed that the cooling system can effectively reduce the temperatures of the chips. Compared with an average temperature of 102°C of the heating dummy chips on the wafer with natural air cooling, an average temperature of 49.2°C was obtained using the wafer-level cooling system. When the water flow rate of the cooling water in the fluidic channel was set to 1.5 L/min, the heat dissipation capacity of the series-type cooling system can reach 0.14 W/mm$^{2}$ and the temperature uniformity of the heating dummy chips on a 4-inch silicon wafer was 98.2%, which indicate the wafer-level cooling method has potential applications in the heat dissipation for the wafer-level systems.
{"title":"Research on the Cooling System for the System-on-Wafer Packaging","authors":"Rong-rong Cao, Guandong Liu, J. Li, Weihao Wang, Chuanzhi Wang, Ling-Li Liu, Yuanxing Duan","doi":"10.1109/NEMS57332.2023.10190863","DOIUrl":"https://doi.org/10.1109/NEMS57332.2023.10190863","url":null,"abstract":"With the advantages of high-density integration and strong function, the system-on-wafer (SoW) packaging technology is a promising method, which can meet the requirements of improving system performances in the post-Moore era. However, the high-density integration also leads to a serious heat dissipation problem. This paper presents a cooling system based on fluidic cooling plates for the SoW packaging. The temperature distributions of the dummy chiplets on a wafer and the heat dissipation capacity of the cooling plates with different shapes of the fluidic channels were researched using the finite element method (FEM). The results of the cooling experiments showed that the cooling system can effectively reduce the temperatures of the chips. Compared with an average temperature of 102°C of the heating dummy chips on the wafer with natural air cooling, an average temperature of 49.2°C was obtained using the wafer-level cooling system. When the water flow rate of the cooling water in the fluidic channel was set to 1.5 L/min, the heat dissipation capacity of the series-type cooling system can reach 0.14 W/mm$^{2}$ and the temperature uniformity of the heating dummy chips on a 4-inch silicon wafer was 98.2%, which indicate the wafer-level cooling method has potential applications in the heat dissipation for the wafer-level systems.","PeriodicalId":142575,"journal":{"name":"2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128592243","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-14DOI: 10.1109/NEMS57332.2023.10190968
Saige Dacuycuy, G. Manio, Matthew T. Kouchi, W. Shiroma, A. Ohta
A liquid-metal unit cell for an intelligent reflecting surface is presented. The unit cell is reconfigured through the continuous electrowetting (CEW) of liquid metal. Actuating the liquid metal mimics the extension of the copper element, enabling two unit-cell states that have a ~200° reflection phase difference at 3.1 GHz.
{"title":"Electrically Actuated Liquid-Metal Unit Cell for an Intelligent Reflecting Surface","authors":"Saige Dacuycuy, G. Manio, Matthew T. Kouchi, W. Shiroma, A. Ohta","doi":"10.1109/NEMS57332.2023.10190968","DOIUrl":"https://doi.org/10.1109/NEMS57332.2023.10190968","url":null,"abstract":"A liquid-metal unit cell for an intelligent reflecting surface is presented. The unit cell is reconfigured through the continuous electrowetting (CEW) of liquid metal. Actuating the liquid metal mimics the extension of the copper element, enabling two unit-cell states that have a ~200° reflection phase difference at 3.1 GHz.","PeriodicalId":142575,"journal":{"name":"2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"53 33","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120887118","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-14DOI: 10.1109/NEMS57332.2023.10190940
Zongqin Ke, Huahuang Luo, Hadi Tavakkoli, Wenhao Chen, Zhaojun Liu, Yi-Kuen Lee
For the first time, an NL PDE (nonlinear partial differential equation)-based compact model to predict the transient thermal behavior of a CMOS-compatible micro PCR (polymerase chain reaction) chip is proposed for rapid device optimization. The model is first validated using experimental data with an average error of 0.4% and then employed to explore the effect of crucial parameters on micro PCR design. According to the parametric scaling analysis, two critical factors - the thickness and the width of micro PCR heaters - show dominant impacts on the performance, including power efficiency, heating rate, and cooling rate. Due to the low computational cost of our compact model, design optimization can be conducted within 10 seconds, approximately 170 times faster than that with typical FEM simulation. After the effective optimization, the heating rate $(Q_{h})$ and cooling rate $(Q_{c})$ improved to $6.347^{circ}mathrm{C}/mathrm{s}$ and 2.159 $^{circ}mathrm{C}/mathrm{s}$, resulting in a significant increase of 799.47% and 166.23%, respectively, compared to the initial design under the identical working conditions. In conclusion, the validated compact model will be promising to be used for next-gen CMOS micro PCR devices using TSMC $0.18mumathrm{m}$ CMOS/CMOS MEMS foundry processes for COVID-19 detection.
{"title":"Novel Compact Model for Rapid Design Optimization of CMOS-compatible Micro-PCR chips for COVID-19 Detection","authors":"Zongqin Ke, Huahuang Luo, Hadi Tavakkoli, Wenhao Chen, Zhaojun Liu, Yi-Kuen Lee","doi":"10.1109/NEMS57332.2023.10190940","DOIUrl":"https://doi.org/10.1109/NEMS57332.2023.10190940","url":null,"abstract":"For the first time, an NL PDE (nonlinear partial differential equation)-based compact model to predict the transient thermal behavior of a CMOS-compatible micro PCR (polymerase chain reaction) chip is proposed for rapid device optimization. The model is first validated using experimental data with an average error of 0.4% and then employed to explore the effect of crucial parameters on micro PCR design. According to the parametric scaling analysis, two critical factors - the thickness and the width of micro PCR heaters - show dominant impacts on the performance, including power efficiency, heating rate, and cooling rate. Due to the low computational cost of our compact model, design optimization can be conducted within 10 seconds, approximately 170 times faster than that with typical FEM simulation. After the effective optimization, the heating rate $(Q_{h})$ and cooling rate $(Q_{c})$ improved to $6.347^{circ}mathrm{C}/mathrm{s}$ and 2.159 $^{circ}mathrm{C}/mathrm{s}$, resulting in a significant increase of 799.47% and 166.23%, respectively, compared to the initial design under the identical working conditions. In conclusion, the validated compact model will be promising to be used for next-gen CMOS micro PCR devices using TSMC $0.18mumathrm{m}$ CMOS/CMOS MEMS foundry processes for COVID-19 detection.","PeriodicalId":142575,"journal":{"name":"2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124482696","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper describes a piezoresistive flexible pressure sensor based on multilevel microstructure, fabricated through infrared picosecond laser technology. Our systematic study of the impact of laser processing parameters on microstructure morphology led to the creation of single-level, double-level, and triple-level 3D-ordered microstructure-based sensors. Experimental results demonstrate that the triple-level microstructure sensor exhibits an ultra-high sensitivity of 138.6 kP$mathrm{a}^{-1}$ and a wide linear range of 400 kPa, surpassing the sensitivity of the single-level sensor of 10.5 kP$mathrm{a}^{-1}$ by 1300%. Moreover, it also surpasses single-level and double-level microstructure-based sensors in terms of measurement range and linearity. Finite element analysis confirms that the sensor based on the triple-level microstructure is more sensitive than sensors based on single-level and double-level microstructures. The proposed method for tailoring microstructure morphology has significant potential for developing pressure sensors with high sensitivity and wide linear range.
{"title":"3D-Ordered Multilevel Microstructures-Based Flexible Pressure Sensor with Ultra-High Sensitivity Utilizing Laser Scribing","authors":"Rui Chen, Qian Wan, Tao Luo, Chen Zhang, Xuyang Chu, Wei Zhou","doi":"10.1109/NEMS57332.2023.10190919","DOIUrl":"https://doi.org/10.1109/NEMS57332.2023.10190919","url":null,"abstract":"This paper describes a piezoresistive flexible pressure sensor based on multilevel microstructure, fabricated through infrared picosecond laser technology. Our systematic study of the impact of laser processing parameters on microstructure morphology led to the creation of single-level, double-level, and triple-level 3D-ordered microstructure-based sensors. Experimental results demonstrate that the triple-level microstructure sensor exhibits an ultra-high sensitivity of 138.6 kP$mathrm{a}^{-1}$ and a wide linear range of 400 kPa, surpassing the sensitivity of the single-level sensor of 10.5 kP$mathrm{a}^{-1}$ by 1300%. Moreover, it also surpasses single-level and double-level microstructure-based sensors in terms of measurement range and linearity. Finite element analysis confirms that the sensor based on the triple-level microstructure is more sensitive than sensors based on single-level and double-level microstructures. The proposed method for tailoring microstructure morphology has significant potential for developing pressure sensors with high sensitivity and wide linear range.","PeriodicalId":142575,"journal":{"name":"2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130446322","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-14DOI: 10.1109/NEMS57332.2023.10190891
Jincheng Wang, Rui Chen, Tao Luo, Linjing Wu, Wei Zhou
This paper presents a flexible multimodal all-in-one structure sensor for pressure and temperature sensing via an ultraviolet (UV) nanosecond laser. To achieve temperature sensing, we laser patterned the flexible thermoelectric generator with the graphene film. Then, we prepared Carbon Powder-Carbon Nanotube/Polydimethylsiloxane (CP-CNT/PDMS) conducting polymers based on the principle of piezoresistive effect, and then fabricated microcone structures using UV laser as pressure-sensing layers. Experimental results show that our sensor can distinguish pressure and temperature signals with only a single channel signal acquisition. Raman spectroscopy analysis shows that P-type doping of graphene films can be performed using FeCl3, and the power factor of thermoelectric generators is four times higher than that before doping. Finite element analysis (FEA) results show a microcone array with a height of 500 μm and a width of 100 μm exhibit optimized sensitivity (sensitivity of 0.587 kPa$^{-1}$) and detection range (range of 160 kPa)
{"title":"A Flexible Multimodal Sensor for Fully Decoupled Crosstalk-Free Pressure and Temperature Sensing via Laser Direct Writing","authors":"Jincheng Wang, Rui Chen, Tao Luo, Linjing Wu, Wei Zhou","doi":"10.1109/NEMS57332.2023.10190891","DOIUrl":"https://doi.org/10.1109/NEMS57332.2023.10190891","url":null,"abstract":"This paper presents a flexible multimodal all-in-one structure sensor for pressure and temperature sensing via an ultraviolet (UV) nanosecond laser. To achieve temperature sensing, we laser patterned the flexible thermoelectric generator with the graphene film. Then, we prepared Carbon Powder-Carbon Nanotube/Polydimethylsiloxane (CP-CNT/PDMS) conducting polymers based on the principle of piezoresistive effect, and then fabricated microcone structures using UV laser as pressure-sensing layers. Experimental results show that our sensor can distinguish pressure and temperature signals with only a single channel signal acquisition. Raman spectroscopy analysis shows that P-type doping of graphene films can be performed using FeCl3, and the power factor of thermoelectric generators is four times higher than that before doping. Finite element analysis (FEA) results show a microcone array with a height of 500 μm and a width of 100 μm exhibit optimized sensitivity (sensitivity of 0.587 kPa$^{-1}$) and detection range (range of 160 kPa)","PeriodicalId":142575,"journal":{"name":"2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133272911","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-14DOI: 10.1109/NEMS57332.2023.10190924
Xiangbin Du, Yuxin Ye, Yanmei Kong, Ruiwen Liu, Shichang Yun, Binbin Jiao, Xiaorui Lv, P. Lin
The increase in chip integration and the demand for computing power has led to the increasing operating temperature of flexible electronic devices with the increase in power density. The embedded microfluidic cooling has the characteristics of low thermal resistance and efficient heat dissipation. In this study, the embedded microfluid cooling with flexible manifold is firstly proposed and demonstrated to manage the thermal accumulation in flexible electronics working at complex conditions, which can transfer the heat from the high heat flux chips to the peripheral environment or device efficiently, with good bending characteristics and high reliability.
{"title":"Embedded manifold cooling for efficient thermal management of flexible electronics","authors":"Xiangbin Du, Yuxin Ye, Yanmei Kong, Ruiwen Liu, Shichang Yun, Binbin Jiao, Xiaorui Lv, P. Lin","doi":"10.1109/NEMS57332.2023.10190924","DOIUrl":"https://doi.org/10.1109/NEMS57332.2023.10190924","url":null,"abstract":"The increase in chip integration and the demand for computing power has led to the increasing operating temperature of flexible electronic devices with the increase in power density. The embedded microfluidic cooling has the characteristics of low thermal resistance and efficient heat dissipation. In this study, the embedded microfluid cooling with flexible manifold is firstly proposed and demonstrated to manage the thermal accumulation in flexible electronics working at complex conditions, which can transfer the heat from the high heat flux chips to the peripheral environment or device efficiently, with good bending characteristics and high reliability.","PeriodicalId":142575,"journal":{"name":"2023 IEEE 18th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114344561","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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