{"title":"混合信号数字子带调谐器多芯片模块","authors":"K. Sienski, C. Field, C. Schreiner, M. Chivers","doi":"10.1109/MCMC.1996.510768","DOIUrl":null,"url":null,"abstract":"Mixed signal designs consisting of analog and digital components bridge the gap between the sensor and data processor in a broad range of systems. As digital MCM technology matures, it becomes feasible to consider incorporating more of a system on a single substrate. In many cases, the opportunity for expansion lies in the analog and digital conversion circuitry. This paper describes the development of a mixed signal module that integrates an A/D converter and digital sub-band tuner in a single MCM. Physical isolation structures are developed to shield the analog signals from electromagnetic noise generated by the digital circuitry. A laser customized rapid prototyping technique is used to implement the design on an MCM-D substrate.","PeriodicalId":126969,"journal":{"name":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Mixed signal digital sub-band tuner multichip module\",\"authors\":\"K. Sienski, C. Field, C. Schreiner, M. Chivers\",\"doi\":\"10.1109/MCMC.1996.510768\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Mixed signal designs consisting of analog and digital components bridge the gap between the sensor and data processor in a broad range of systems. As digital MCM technology matures, it becomes feasible to consider incorporating more of a system on a single substrate. In many cases, the opportunity for expansion lies in the analog and digital conversion circuitry. This paper describes the development of a mixed signal module that integrates an A/D converter and digital sub-band tuner in a single MCM. Physical isolation structures are developed to shield the analog signals from electromagnetic noise generated by the digital circuitry. A laser customized rapid prototyping technique is used to implement the design on an MCM-D substrate.\",\"PeriodicalId\":126969,\"journal\":{\"name\":\"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-02-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1996.510768\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1996.510768","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Mixed signal digital sub-band tuner multichip module
Mixed signal designs consisting of analog and digital components bridge the gap between the sensor and data processor in a broad range of systems. As digital MCM technology matures, it becomes feasible to consider incorporating more of a system on a single substrate. In many cases, the opportunity for expansion lies in the analog and digital conversion circuitry. This paper describes the development of a mixed signal module that integrates an A/D converter and digital sub-band tuner in a single MCM. Physical isolation structures are developed to shield the analog signals from electromagnetic noise generated by the digital circuitry. A laser customized rapid prototyping technique is used to implement the design on an MCM-D substrate.