测试点插入对布局时硅面积和时间的影响

H. Vranken, Ferry Syafei Sapei, H. Wunderlich
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引用次数: 20

摘要

本文对测试点插入对电路尺寸和性能的影响进行了实验研究。为了提高电路的可测试性,通常会在电路中插入测试点,从而实现更小的测试数据量、更短的测试时间和更高的故障覆盖率。然而,插入测试点需要额外的硅面积,并影响电路的时序。本文阐述了在版图生成过程中,测试点的插入对布局和布线的影响。工业电路的实验数据表明,一般来说,插入1%的测试点可使布局后的硅面积增加不到0.5%,而电路的性能可能下降5%或更多。
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Impact of test point insertion on silicon area and timing during layout
This paper presents an experimental investigation on the impact of test point insertion on circuit size and performance. Often test points are inserted into a circuit in order to improve the circuit's testability, which results in smaller test data volume, shorter test time, and higher fault coverage. Inserting test points however requires additional silicon area and influences the timing of a circuit. The paper shows how placement and routing is affected by test point insertion during layout generation. Experimental data for industrial circuits show that inserting 1% test points in general increases the silicon area after layout by less than 0.5% while the performance of the circuit may be reduced by 5% or more.
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