高温下Si和SiGe源组成的nw - tfet模拟参数分析

C. Bordallo, J. Martino, P. Agopian, R. Rooyackers, A. Vandooren, A. Thean, E. Simoen, C. Claeys
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引用次数: 4

摘要

在这项工作中,在高温和两种不同的源成分(Si和Si0.73Ge0.27)下,对隧道场效应管器件的模拟参数进行了分析。对于高栅极电压,带到带隧穿是主要机制,因此,观察到输出电导(gD),早期电压(VEA)和固有电压增益(AV)的下降。在SiGe器件中,陷阱辅助隧道是低栅极偏压下的主要机制,它提高了gD、VEA,从而提高了AV。温度增加离子和IOFF电流导致gD、VEA和AV下降。晶体管效率(gm/ID)在“弱反转区”高温下降低,在“强反转区”高电流下提高。
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Analysis of analog parameters in NW-TFETs with Si and SiGe source composition at high temperatures
In this work, the analysis of analog parameters in Tunnel-FET devices is performed at high temperatures and for two different source compositions (Si and Si0.73Ge0.27). For high gate voltage, band-to-band tunneling is the dominant mechanism, and due to that, a degradation in output conductance (gD), early voltage (VEA) and intrinsic voltage gain (AV) was observed. In the SiGe devices, trap assisted tunneling is the dominant mechanism at low gate bias, which improves gD, VEA and consequently AV. The temperature increases both ION and IOFF current leading to a degradation of gD, VEA and AV. The transistor efficiency (gm/ID) decreases at high temperature in the “weak inversion region” and improves in the “strong inversion region” at high current.
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