高速ATM交换系统的多芯片模块技术

Proceedings of the International Conference on Multichip Modules Pub Date : 1994-04-13 DOI:10.1109/ICMCM.1994.753541

S. Sasaki, T. Kishimoto, K. Genda, K. Endo, K. Kaizu

{"title":"高速ATM交换系统的多芯片模块技术","authors":"S. Sasaki, T. Kishimoto, K. Genda, K. Endo, K. Kaizu","doi":"10.1109/ICMCM.1994.753541","DOIUrl":null,"url":null,"abstract":"High-performance, compact multichip modules (MCMs) using a copper polyimide multi-layer substrate are used to make a 40-Gb/s-throughput ATM switching module. The MCM substrate has 392 high-speed signal I/0 channels, thin-film termination resistors, and 50 /spl mu/m laminated capacitance layers. We made a sub switching element module using these MCMs, new high-speed FPC cables, and heat pipes fins. This sub-switching element module can operate at 80 Gb/s throughput.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"52 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Multichip module technologies for high-speed ATM switching systems\",\"authors\":\"S. Sasaki, T. Kishimoto, K. Genda, K. Endo, K. Kaizu\",\"doi\":\"10.1109/ICMCM.1994.753541\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High-performance, compact multichip modules (MCMs) using a copper polyimide multi-layer substrate are used to make a 40-Gb/s-throughput ATM switching module. The MCM substrate has 392 high-speed signal I/0 channels, thin-film termination resistors, and 50 /spl mu/m laminated capacitance layers. We made a sub switching element module using these MCMs, new high-speed FPC cables, and heat pipes fins. This sub-switching element module can operate at 80 Gb/s throughput.\",\"PeriodicalId\":363745,\"journal\":{\"name\":\"Proceedings of the International Conference on Multichip Modules\",\"volume\":\"52 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-04-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the International Conference on Multichip Modules\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMCM.1994.753541\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753541","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 16

摘要

采用聚酰亚胺铜多层基板的高性能、紧凑型多芯片模块(mcm)用于制造吞吐量为40 gb /s的ATM交换模块。MCM衬底具有392个高速信号I/0通道，薄膜终端电阻和50 /spl mu/m的层压电容层。我们使用这些mcm，新型高速FPC电缆和热管翅片制作了子开关元件模块。该子交换元件模块的吞吐量为80gb /s。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Multichip module technologies for high-speed ATM switching systems

High-performance, compact multichip modules (MCMs) using a copper polyimide multi-layer substrate are used to make a 40-Gb/s-throughput ATM switching module. The MCM substrate has 392 high-speed signal I/0 channels, thin-film termination resistors, and 50 /spl mu/m laminated capacitance layers. We made a sub switching element module using these MCMs, new high-speed FPC cables, and heat pipes fins. This sub-switching element module can operate at 80 Gb/s throughput.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings of the International Conference on Multichip Modules

自引率

0.00%

发文量