{"title":"基于spice的led瞬态热电子模型","authors":"Bo Sun, Jiajie Fan, Xuejun Fan, Guoqi Zhang","doi":"10.1109/EUROSIME.2019.8724555","DOIUrl":null,"url":null,"abstract":"In this work, a SPICE-based transient thermal-electronic simulation model of LEDs with consideration of transient temperature is developed. A RC network is used to simulate the thermal compact model, which voltage distribution equals to thermal compact model’s temperature distribution numerically. Voltage and current dependent current sources are used as sources of heat and light. A non-linear dependent source is used to simulate LED’s AC behavior. Thermal model and optical model can be integrated with the LED’s electronic model. Iteration processes for calculations of electronic-thermal-optical coupling effects can be carried out by the SPICE solver automatically without convergence problem. A selected type of LEDs is measured in different temperature and current levels to verify the proposed model. It has been found that electronic, thermal and optical parameters have good agreement with testing results. Values of major parameters in the propose model have been extracted.","PeriodicalId":357224,"journal":{"name":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A SPICE-based Transient Thermal-Electronic Model for LEDs\",\"authors\":\"Bo Sun, Jiajie Fan, Xuejun Fan, Guoqi Zhang\",\"doi\":\"10.1109/EUROSIME.2019.8724555\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, a SPICE-based transient thermal-electronic simulation model of LEDs with consideration of transient temperature is developed. A RC network is used to simulate the thermal compact model, which voltage distribution equals to thermal compact model’s temperature distribution numerically. Voltage and current dependent current sources are used as sources of heat and light. A non-linear dependent source is used to simulate LED’s AC behavior. Thermal model and optical model can be integrated with the LED’s electronic model. Iteration processes for calculations of electronic-thermal-optical coupling effects can be carried out by the SPICE solver automatically without convergence problem. A selected type of LEDs is measured in different temperature and current levels to verify the proposed model. It has been found that electronic, thermal and optical parameters have good agreement with testing results. Values of major parameters in the propose model have been extracted.\",\"PeriodicalId\":357224,\"journal\":{\"name\":\"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-03-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2019.8724555\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2019.8724555","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

本文建立了一个基于spice的考虑瞬态温度的led瞬态热电子仿真模型。采用RC网络对热密实模型进行了数值模拟,其电压分布等于热密实模型的温度分布。电压和电流相关的电流源被用作热源和光源。非线性依赖源用于模拟LED的交流行为。热模型和光学模型可以与LED的电子模型集成。SPICE求解器可以自动进行电子-热-光耦合效应计算的迭代过程,没有收敛问题。在不同的温度和电流水平下测量选定类型的led以验证所提出的模型。电子、热、光学参数与测试结果吻合较好。提取了该模型的主要参数值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
A SPICE-based Transient Thermal-Electronic Model for LEDs
In this work, a SPICE-based transient thermal-electronic simulation model of LEDs with consideration of transient temperature is developed. A RC network is used to simulate the thermal compact model, which voltage distribution equals to thermal compact model’s temperature distribution numerically. Voltage and current dependent current sources are used as sources of heat and light. A non-linear dependent source is used to simulate LED’s AC behavior. Thermal model and optical model can be integrated with the LED’s electronic model. Iteration processes for calculations of electronic-thermal-optical coupling effects can be carried out by the SPICE solver automatically without convergence problem. A selected type of LEDs is measured in different temperature and current levels to verify the proposed model. It has been found that electronic, thermal and optical parameters have good agreement with testing results. Values of major parameters in the propose model have been extracted.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A SPICE-based Transient Thermal-Electronic Model for LEDs Electromigration Effects in Corroded BGA Accelerated Pump Out Testing for Thermal Greases Effect of material properties on PCB frequencies in electronic control unit Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1