电子外壳内温度和湿度响应的电阻-电容建模方法

Z. Staliulionis, S. Mohanty, J. Hattel
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引用次数: 5

摘要

水分是影响电子设备可靠性、功能性和耐用性的重要因素。如今,建模工具已成为电子设计中不可或缺的一部分,因为它们在寻找最佳的湿度控制设计时成本较低。由于计算量大,CFD和FEM非常耗时,因此需要一种更快、空间分辨率更低的方法,如众所周知的电阻-电容(RC)方法。本文关注内部代码的发展,使用RC方法模拟非等温条件下电子外壳内的热量和水分耦合传输。然后,将仿真结果与相应的实验结果进行了比较,以验证所开发代码的有效性。在与试验对比的基础上,提出了一种新的配置RC模型,以提高湿度预报的精度。一般来说,新的RC模型将吸附和解吸机理作为集总电容包含在其两侧的壁面上。这样的修改提高了与实验的一致性。
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Resistor-Capacitor Approach for Modelling of Temperature and Humidity Response Inside Electronic Enclosures
Moisture is an important factor to reliability, functionality and durability of electronic devices. Nowadays, modelling tools have become an integral part of electronics design, because they are less expensive for searching the optimal design of moisture control. CFD and FEM are very time consuming due to their computational effort, therefore it is desirable to have a method such as well-known Resistor-Capacitor (RC) approach which is faster and has less spatial resolution. The paper concerns the development of an in-house code using the RC approach for simulating coupled heat and moisture transport inside electronic enclosure under non-isothermal conditions. Thereafter, the simulations results were compared with corresponding experiments in order to validate the developed code. Based on comparison with experiments, a new configuration RC model was developed for a more accurate humidity prediction. In general new RC model had the adsorption and desorption mechanisms included as a lumped capacitance for describing the surface of a wall on its both sides. Such modification improved the agreement with experiments.
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