{"title":"多层陶瓷电容器的有限元建模及断裂力学方法","authors":"J. Al Ahmar, S. Wiese","doi":"10.1109/EUROSIME.2015.7103147","DOIUrl":null,"url":null,"abstract":"A finite element model of a 1206 Multilayer Ceramic Capacitor (MLCC) has been developed using ANSYS. The component reliability is examined using a fracture mechanical approach. Micro cracks at the ceramic termination interface, due to thermal shock after solder reflow, are examined and fracture parameters during board flexing are estimated. Based on the brittle material behavior of ceramics, they can be considered as an ideal elastic material and so linear elastic fracture mechanics can be applied. The crack susceptible regions and calculated crack paths in the simulation agree with typically crack propagation observed in MLCC bending experiments.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"A finite element modelling and fracture mechanical approach of Multilayer Ceramic Capacitors\",\"authors\":\"J. Al Ahmar, S. Wiese\",\"doi\":\"10.1109/EUROSIME.2015.7103147\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A finite element model of a 1206 Multilayer Ceramic Capacitor (MLCC) has been developed using ANSYS. The component reliability is examined using a fracture mechanical approach. Micro cracks at the ceramic termination interface, due to thermal shock after solder reflow, are examined and fracture parameters during board flexing are estimated. Based on the brittle material behavior of ceramics, they can be considered as an ideal elastic material and so linear elastic fracture mechanics can be applied. The crack susceptible regions and calculated crack paths in the simulation agree with typically crack propagation observed in MLCC bending experiments.\",\"PeriodicalId\":250897,\"journal\":{\"name\":\"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"volume\":\"40 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-04-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2015.7103147\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2015.7103147","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A finite element modelling and fracture mechanical approach of Multilayer Ceramic Capacitors
A finite element model of a 1206 Multilayer Ceramic Capacitor (MLCC) has been developed using ANSYS. The component reliability is examined using a fracture mechanical approach. Micro cracks at the ceramic termination interface, due to thermal shock after solder reflow, are examined and fracture parameters during board flexing are estimated. Based on the brittle material behavior of ceramics, they can be considered as an ideal elastic material and so linear elastic fracture mechanics can be applied. The crack susceptible regions and calculated crack paths in the simulation agree with typically crack propagation observed in MLCC bending experiments.
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