3D异质集成与2D材料

2019 Silicon Nanoelectronics Workshop (SNW) Pub Date : 2019-06-01 DOI:10.23919/SNW.2019.8782932

C. McClellan, C. Bailey, I. Datye, A. Gabourie, R. Grady, K. Schauble, S. Vaziri, E. Pop

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引用次数: 0

摘要

随着传统设备规模的放缓，需要三维集成电路(ic)来继续摩尔定律的进步。我们表明，二维(2D)半导体由于其原子薄的性质和独特的加工、热和器件能力，在异质集成3D集成电路中很有前景。

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3D Heterogeneous Integration with 2D Materials

As traditional device scaling slows down, three-dimensional (3D) integrated circuits (ICs) are needed to continue Moore’s Law advancements. We show that two-dimensional (2D) semiconductors are promising for heterogeneously integrated 3D ICs owing to their atomically thin nature and unique processing, thermal, and device capabilities.

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2019 Silicon Nanoelectronics Workshop (SNW)

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