{"title":"球栅元件阵列的数值分析","authors":"R. Cole, M. Davies","doi":"10.1109/ITHERM.2002.1012439","DOIUrl":null,"url":null,"abstract":"Numerical modeling is a valuable analysis tool, however it is still a time consuming process and it is imperative that models be validated. The authors have proposed an alternative to full-scale numerical modeling as a first level design tool, which involves the use aerodynamic and thermal influence factors. Cole et al. [2001] presented a ball grid array (BGA) test apparatus, and also presented aerodynamic measurements made using particle image velocimetry (PIV). Part II of that paper presented thermal resistance measurements, influence factors calculated, and infrared images of surface temperatures. This paper presents numerical models made with an industry standard computational fluid dynamics (CFD) package, using the benchmark data provided from the previous work. The objective is to validate the numerical models, in order to be able to examine additional geometries.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Numerical analysis of an array of ball grid components\",\"authors\":\"R. Cole, M. Davies\",\"doi\":\"10.1109/ITHERM.2002.1012439\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Numerical modeling is a valuable analysis tool, however it is still a time consuming process and it is imperative that models be validated. The authors have proposed an alternative to full-scale numerical modeling as a first level design tool, which involves the use aerodynamic and thermal influence factors. Cole et al. [2001] presented a ball grid array (BGA) test apparatus, and also presented aerodynamic measurements made using particle image velocimetry (PIV). Part II of that paper presented thermal resistance measurements, influence factors calculated, and infrared images of surface temperatures. This paper presents numerical models made with an industry standard computational fluid dynamics (CFD) package, using the benchmark data provided from the previous work. The objective is to validate the numerical models, in order to be able to examine additional geometries.\",\"PeriodicalId\":299933,\"journal\":{\"name\":\"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)\",\"volume\":\"56 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ITHERM.2002.1012439\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2002.1012439","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Numerical analysis of an array of ball grid components
Numerical modeling is a valuable analysis tool, however it is still a time consuming process and it is imperative that models be validated. The authors have proposed an alternative to full-scale numerical modeling as a first level design tool, which involves the use aerodynamic and thermal influence factors. Cole et al. [2001] presented a ball grid array (BGA) test apparatus, and also presented aerodynamic measurements made using particle image velocimetry (PIV). Part II of that paper presented thermal resistance measurements, influence factors calculated, and infrared images of surface temperatures. This paper presents numerical models made with an industry standard computational fluid dynamics (CFD) package, using the benchmark data provided from the previous work. The objective is to validate the numerical models, in order to be able to examine additional geometries.