SRAM位线电迁移机制及其预防方案

Zhong Guan, M. Marek-Sadowska, S. Nassif
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引用次数: 17

摘要

在本文中,我们证明SRAM阵列中的信号线容易发生电迁移(EM)。我们的分析表明,读操作可以引起位线上的单向电流流动。因此,位线的长度不仅应受到性能要求的限制,还应受到Blech长度约束的限制,以避免EM。我们提出了一种在布局约束下确定位线宽度的方法,以最大限度地增加附着在位线上的单元数,同时保证位线的可靠性并保持SRAM性能。我们还研究了SRAM参数变化对em安全位线长度的影响。仿真结果表明,电磁安全位线长度随着技术规模、温度或频率的升高以及参数变化的增加而减小。
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SRAM bit-line electromigration mechanism and its prevention scheme
In this paper, we demonstrate that signal lines in SRAM arrays are prone to electromigration (EM). Our analysis shows that the read operation can cause unidirectional current flow in bit-lines. Thus the length of bit-lines should be bounded not only by performance requirements, but also by the Blech length constraint to avoid EM. We propose a method of determining the bit-line width under layout constraints to maximize the number of cells attached to a bit-line, while ensuing the reliability of the bit-line and maintaining SRAM performance. We also study the effects of SRAM parameter variations on the EM-safe bit-line length. Simulation results show that the EM-safe bit-line length decreases as technology scales, temperature or frequency rise, and parameter variations increase.
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