六西格玛- DIDOV框架设计中的热设计

I. Luiten
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引用次数: 7

摘要

激烈的竞争推动了消费电子产品和产品开发过程的不断改进。六西格玛设计(Dfss)方法的DIDOV(定义、识别、设计、优化和验证)版本被广泛推荐为改进的手段,特别是在研发环境中。由于应用领域广泛,Dfss-DIDOV方法的表述非常抽象,这使得它很难与工程世界联系起来。本文以某消费类电子产品的散热设计为例,对该方法进行了评估。本文首先讨论了DIDOV方法,并与热设计流程进行了比较。然后,通过一个热设计案例对该方法进行了说明。
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Thermal design in the Design for Six Sigma — DIDOV framework
Fierce competition drives continuous improvement of products and product development processes in consumer electronics. The DIDOV (Define, Identify, Design, Optimize, and Verify) version of the Design for Six Sigma (Dfss) approach is widely recommended a means to improvement, especially in R&D environments. Due to the wide field of application, the Dfss-DIDOV method is formulated in very abstract terms, which makes it difficult to relate it to the engineering world. In this paper, the method is assessed in the context of the thermal design of electronics cooling in a consumer electronics product. The paper starts with a discussion of the DIDOV methodology and a comparison to thermal design flow. Next, the method is illustrated on a thermal design case.
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