{"title":"物联网道路上的成本挑战","authors":"W. Rhines","doi":"10.1109/VLSI-DAT.2015.7114553","DOIUrl":null,"url":null,"abstract":"One of the great promises of the Internet of Things (IoT) is the extraordinarily large volume of semiconductor components that will be required for smart sensors and actuators, as well as for big digital chips to do the information processing. Yet the growing complexity that comes from shrinking design rules, ultra-low power mixed signal design and diverse packaging are threatening the traditional reduction in cost per transistor that has fueled semiconductor industry growth in the past. Dr. Rhines will analyze the evolution of semiconductor design and production costs to provide predictions of what designers will have to work with in the coming decade and what capabilities will be enabled.","PeriodicalId":369130,"journal":{"name":"VLSI Design, Automation and Test(VLSI-DAT)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Cost challenges on the way to the Internet of Things\",\"authors\":\"W. Rhines\",\"doi\":\"10.1109/VLSI-DAT.2015.7114553\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"One of the great promises of the Internet of Things (IoT) is the extraordinarily large volume of semiconductor components that will be required for smart sensors and actuators, as well as for big digital chips to do the information processing. Yet the growing complexity that comes from shrinking design rules, ultra-low power mixed signal design and diverse packaging are threatening the traditional reduction in cost per transistor that has fueled semiconductor industry growth in the past. Dr. Rhines will analyze the evolution of semiconductor design and production costs to provide predictions of what designers will have to work with in the coming decade and what capabilities will be enabled.\",\"PeriodicalId\":369130,\"journal\":{\"name\":\"VLSI Design, Automation and Test(VLSI-DAT)\",\"volume\":\"57 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-04-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"VLSI Design, Automation and Test(VLSI-DAT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSI-DAT.2015.7114553\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"VLSI Design, Automation and Test(VLSI-DAT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI-DAT.2015.7114553","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Cost challenges on the way to the Internet of Things
One of the great promises of the Internet of Things (IoT) is the extraordinarily large volume of semiconductor components that will be required for smart sensors and actuators, as well as for big digital chips to do the information processing. Yet the growing complexity that comes from shrinking design rules, ultra-low power mixed signal design and diverse packaging are threatening the traditional reduction in cost per transistor that has fueled semiconductor industry growth in the past. Dr. Rhines will analyze the evolution of semiconductor design and production costs to provide predictions of what designers will have to work with in the coming decade and what capabilities will be enabled.