潜在开放试验的应用

L. Economikos, S. Chiang, A. Halperin
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引用次数: 1

摘要

随着多芯片模块(MCM)中的金属互连变得越来越窄和薄,在正常的制造过程中,潜在的开放缺陷(如缺口、刻痕、弱连接等)将更有可能发生。我们已经应用相敏非线性检测技术来检测MCM-D和MCM-C衬底的潜在开放缺陷。报道了该技术在开口修补技术和焊线工艺控制中的应用。
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Applications of Latent Open Test
As metal interconnections in multichip modules (MCM) are getting narrower and thinner, latent open defects such as notches, nicks, weak connections, etc., will have a greater chance to occur under normal manufacturing processes. We have applied a phase-sensitive nonlinearity detection technique to detect such latent open defects in MCM-D and MCM-C substrates. Use of this technique for qualifying opens repair techniques and wire bonding process control is reported.
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