{"title":"高速信道SI-PD联合仿真与协同设计方法","authors":"M. J. Choi, V. Pandit, W. Ryu","doi":"10.1109/EPEP.2007.4387140","DOIUrl":null,"url":null,"abstract":"SI-PD co-modeling, co-simulation, and system response optimization are demonstrated that employ passive modeling of signals and power delivery networks to optimize the system response. Decomposition of the system response and system optimization examples are introduced as well.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"221 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"SI-PD Co-simulation and Co-design Methodology for High Speed Channel\",\"authors\":\"M. J. Choi, V. Pandit, W. Ryu\",\"doi\":\"10.1109/EPEP.2007.4387140\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"SI-PD co-modeling, co-simulation, and system response optimization are demonstrated that employ passive modeling of signals and power delivery networks to optimize the system response. Decomposition of the system response and system optimization examples are introduced as well.\",\"PeriodicalId\":402571,\"journal\":{\"name\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"221 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2007.4387140\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387140","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
SI-PD Co-simulation and Co-design Methodology for High Speed Channel
SI-PD co-modeling, co-simulation, and system response optimization are demonstrated that employ passive modeling of signals and power delivery networks to optimize the system response. Decomposition of the system response and system optimization examples are introduced as well.
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