具有多通孔和有限地平面的先进多层封装的建模

2007 IEEE Electrical Performance of Electronic Packaging Pub Date : 2007-11-21 DOI:10.1109/EPEP.2007.4387180

E. Liu, Xingchang Wei, Z. Oo, E. Li, Lewei Li

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引用次数: 12

摘要

提出了一种系统级建模方法，该方法结合了矩量法(MoM)和散射矩阵法(SMM)，用于高级电子封装的建模(Oo et al.， 2007)。本文的重点是用SMM方法解决多层多通孔耦合和有限地面效应问题。SMM方法的重要扩展有助于对具有有限功率/地平面的多层封装中密集过孔之间的耦合进行建模。该方法适用于系统级封装的信号和功率完整性分析，甚至电磁干扰分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Modeling of Advanced Multilayered Packages with Multiple Vias and Finite Ground Planes

A system-level modeling approach, which combines the MoM (method of moments) and the SMM (scattering matrix method) has been presented for the modeling of advanced electronic packages (Oo et al., 2007). The focus of this paper is on addressing the problems of multilayered multiple via coupling and finite ground effects by the SMM method. Significant extensions of the SMM method facilitate the modeling of coupling among densely populated vias in multilayered packages with finite power/ground planes. The proposed approach is suitable for the signal and power integrity, and even EMI analysis of packages at system level.

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2007 IEEE Electrical Performance of Electronic Packaging

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