{"title":"塑料封装铜引线框架/环氧贴片封装系统的可靠性研究","authors":"J. R. Howell","doi":"10.1109/IRPS.1981.362981","DOIUrl":null,"url":null,"abstract":"This paper presents the evaluation methods used to appraise the reliability of plastic/copper lead frame packaging systems. A discussion of the copper/epoxy system, suspected failure mechanisms, tests designed to explore these mechanisms, and data developed during this study are presented. The data presented indicates the copper/epoxy system can meet or exceed the reliability of the Alloy 42 system.","PeriodicalId":376954,"journal":{"name":"19th International Reliability Physics Symposium","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1981-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Reliability Study of Plastic Encapsulated Copper Lead Frame/Epoxy Die Attach Packaging System\",\"authors\":\"J. R. Howell\",\"doi\":\"10.1109/IRPS.1981.362981\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the evaluation methods used to appraise the reliability of plastic/copper lead frame packaging systems. A discussion of the copper/epoxy system, suspected failure mechanisms, tests designed to explore these mechanisms, and data developed during this study are presented. The data presented indicates the copper/epoxy system can meet or exceed the reliability of the Alloy 42 system.\",\"PeriodicalId\":376954,\"journal\":{\"name\":\"19th International Reliability Physics Symposium\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1981-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"19th International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1981.362981\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"19th International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1981.362981","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliability Study of Plastic Encapsulated Copper Lead Frame/Epoxy Die Attach Packaging System
This paper presents the evaluation methods used to appraise the reliability of plastic/copper lead frame packaging systems. A discussion of the copper/epoxy system, suspected failure mechanisms, tests designed to explore these mechanisms, and data developed during this study are presented. The data presented indicates the copper/epoxy system can meet or exceed the reliability of the Alloy 42 system.
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