低温生长GaAs绝缘体对GaAs- fet击穿电压的改善

H. Thomas, J.K. Luo, D. Morgan, D. Westwood, K. Lipka, E. Splingart, E. Kohn
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摘要

采用低温分子束外延生长的砷化镓层被用作功率砷化镓场效应晶体管(misfet)的绝缘体。研究发现,LT-GaAs层成功地钝化了gaas - fet的表面,消除了漏源电流的滞后现象,改善了击穿性能。当栅极和漏极触点间距为2 /spl mu/m时,misfet的击穿电压V/sub BD/高达40- 50v,且与掺杂厚度乘积无关。V/sub BD/也随温度的降低而增加,表明在高频域中击穿电压较高。正是生长的LT-GaAs层的特殊电学特性被发现是LT-GaAs misfet具有优越性能的原因。LT-GaAs层表现出欧姆行为,导致栅极和漏极之间的电场呈线性分布。优势的跳变传导消除了注入电子的集中,而LT-GaAs层的高击穿场保证了LT-GaAs misfet的高击穿电压。
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Improvement of the breakdown voltage of GaAs-FETs using low-temperature-grown GaAs insulator
An as-grown GaAs layer grown by molecular beam epitaxy at low temperature (LT-) has been used as an insulator for power GaAs field effect transistors (MISFETs). It was found that the LT-GaAs layer successfully passivates the surface, of GaAs-FETs, eliminates the hysterisis of drain-source current, and improves the breakdown behaviour. The breakdown voltage, V/sub BD/, for MISFETs is as high as 40-50 V for 2 /spl mu/m spacing between the gate and drain contacts, and is independent of the doping-thickness product. V/sub BD/ also exhibits an increase on decrease of temperature, and suggests a high breakdown voltage in the high frequency domain. It is the particular electrical properties of the as-grown LT-GaAs layer which are found to be responsible for the superior properties of the LT-GaAs MISFETs. The LT-GaAs layer exhibits ohmic behaviour which leads to a linear distribution of electric field between the gate and drain. The dominant hopping conduction eliminates the concentration of injected electrons, while the high breakdown field of the LT-GaAs layer ensures a high breakdown voltage of LT-GaAs MISFETs.
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