{"title":"小晶片上的电力系统:电感连接的多输出开关电容器小晶片上的多轨电力输送","authors":"Mian Liao, Daniel H. Zhou, P. Wang, Minjie Chen","doi":"10.1109/3D-PEIM55914.2023.10052630","DOIUrl":null,"url":null,"abstract":"The energy demand of future computing introduces new challenges in voltage regulator design. This paper explores an inductor-linked single-input multi-output hybrid switched-capacitor power architecture with modular output cells for 48-V to point-of-load (PoL) chiplet power delivery. The unique inductor-linked configuration of switched-capacitor circuits enables high performance with a high voltage conversion ratio while achieving high efficiency and high power density. The architecture can be used, for example, to support multiple loads in a chiplet with many voltage rails from a high voltage input.","PeriodicalId":106578,"journal":{"name":"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"123 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Power Systems on Chiplet: Inductor-Linked Multi-Output Switched-Capacitor Multi-Rail Power Delivery on Chiplets\",\"authors\":\"Mian Liao, Daniel H. Zhou, P. Wang, Minjie Chen\",\"doi\":\"10.1109/3D-PEIM55914.2023.10052630\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The energy demand of future computing introduces new challenges in voltage regulator design. This paper explores an inductor-linked single-input multi-output hybrid switched-capacitor power architecture with modular output cells for 48-V to point-of-load (PoL) chiplet power delivery. The unique inductor-linked configuration of switched-capacitor circuits enables high performance with a high voltage conversion ratio while achieving high efficiency and high power density. The architecture can be used, for example, to support multiple loads in a chiplet with many voltage rails from a high voltage input.\",\"PeriodicalId\":106578,\"journal\":{\"name\":\"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)\",\"volume\":\"123 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/3D-PEIM55914.2023.10052630\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3D-PEIM55914.2023.10052630","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Power Systems on Chiplet: Inductor-Linked Multi-Output Switched-Capacitor Multi-Rail Power Delivery on Chiplets
The energy demand of future computing introduces new challenges in voltage regulator design. This paper explores an inductor-linked single-input multi-output hybrid switched-capacitor power architecture with modular output cells for 48-V to point-of-load (PoL) chiplet power delivery. The unique inductor-linked configuration of switched-capacitor circuits enables high performance with a high voltage conversion ratio while achieving high efficiency and high power density. The architecture can be used, for example, to support multiple loads in a chiplet with many voltage rails from a high voltage input.