{"title":"基于亲疏水处理的低温直接InP/SOI晶圆键合","authors":"Kewei Gong, Changzheng Sun, B. Xiong, Yi Luo","doi":"10.1109/ICIPRM.2014.6880548","DOIUrl":null,"url":null,"abstract":"We report a novel method for direct InP/SOI wafer bonding based on hydrophilic/hydrophobic treatment, which requires only a low annealing temperature of 320°C. Scanning acoustic microscope (SAM) measurements show that the proposed treatment helps form a firm bond between the wafer pair. The bonding strength is measured with a destructive approach, and the bonding interface is evaluated by scanning electron microscope (SEM).","PeriodicalId":181494,"journal":{"name":"26th International Conference on Indium Phosphide and Related Materials (IPRM)","volume":"432 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Low temperature direct InP/SOI wafer bonding based on hydrophilic/hydrophobic treatment\",\"authors\":\"Kewei Gong, Changzheng Sun, B. Xiong, Yi Luo\",\"doi\":\"10.1109/ICIPRM.2014.6880548\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We report a novel method for direct InP/SOI wafer bonding based on hydrophilic/hydrophobic treatment, which requires only a low annealing temperature of 320°C. Scanning acoustic microscope (SAM) measurements show that the proposed treatment helps form a firm bond between the wafer pair. The bonding strength is measured with a destructive approach, and the bonding interface is evaluated by scanning electron microscope (SEM).\",\"PeriodicalId\":181494,\"journal\":{\"name\":\"26th International Conference on Indium Phosphide and Related Materials (IPRM)\",\"volume\":\"432 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"26th International Conference on Indium Phosphide and Related Materials (IPRM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICIPRM.2014.6880548\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"26th International Conference on Indium Phosphide and Related Materials (IPRM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICIPRM.2014.6880548","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Low temperature direct InP/SOI wafer bonding based on hydrophilic/hydrophobic treatment
We report a novel method for direct InP/SOI wafer bonding based on hydrophilic/hydrophobic treatment, which requires only a low annealing temperature of 320°C. Scanning acoustic microscope (SAM) measurements show that the proposed treatment helps form a firm bond between the wafer pair. The bonding strength is measured with a destructive approach, and the bonding interface is evaluated by scanning electron microscope (SEM).
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