高速VLSI器件封装和互连寄生的不同电测量技术

Proceedings of NORTHCON '94 Pub Date : 1994-10-11 DOI:10.1109/NORTHC.1994.643327

C. Huang, F. Wong, D. Kim

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引用次数: 1

摘要

本文将讨论目前工业中用于提取封装和互连电寄生的几种测量技术。具体来说，将涵盖的技术是半标准(G23-84)方法，阻抗方法和网络分析方法。本文将介绍用这些方法测量的数据。将理论分析和软件仿真结果进行比较，讨论每种方法的优缺点。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Different electrical measuring techniques of package and interconnect parasitics for high speed VLSI devices

This paper will discuss several measuring techniques that are used in the industry today for extraction of electrical parasitics of packages and interconnects. Specifically, the techniques that will be covered are the SEMI-Standard (G23-84) method, the impedance method, and the network analysis method. The data measured from these methods will be presented. Theoretical analysis and simulation results from software will be compared to discuss the advantages and disadvantages of each method.

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Proceedings of NORTHCON '94

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