{"title":"基于波形松弛和横向划分的高速互连快速电磁兼容分析","authors":"A. Sridhar, N. Nakhla, R. Achar, M. Nakhla","doi":"10.1109/EPEP.2007.4387194","DOIUrl":null,"url":null,"abstract":"This paper presents an efficient method for simulating a large number of coupled interconnects in the presence of electromagnetic interference. The algorithm is based on transverse partitioning and waveform relaxation techniques. The computational cost of the proposed algorithm increases only linearly with the number of lines compared to the more than cubic growth in conventional methods. In addition, the algorithm gives leads to parallel implementation providing further savings in computational cost.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"109 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Fast EMC Analysis of High-Speed Interconnects via Waveform Relaxation and Transverse Partitioning\",\"authors\":\"A. Sridhar, N. Nakhla, R. Achar, M. Nakhla\",\"doi\":\"10.1109/EPEP.2007.4387194\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents an efficient method for simulating a large number of coupled interconnects in the presence of electromagnetic interference. The algorithm is based on transverse partitioning and waveform relaxation techniques. The computational cost of the proposed algorithm increases only linearly with the number of lines compared to the more than cubic growth in conventional methods. In addition, the algorithm gives leads to parallel implementation providing further savings in computational cost.\",\"PeriodicalId\":402571,\"journal\":{\"name\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"109 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2007.4387194\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387194","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fast EMC Analysis of High-Speed Interconnects via Waveform Relaxation and Transverse Partitioning
This paper presents an efficient method for simulating a large number of coupled interconnects in the presence of electromagnetic interference. The algorithm is based on transverse partitioning and waveform relaxation techniques. The computational cost of the proposed algorithm increases only linearly with the number of lines compared to the more than cubic growth in conventional methods. In addition, the algorithm gives leads to parallel implementation providing further savings in computational cost.