由于TEOS/O/sub - 3/-氧化物中有水和ECR-SiO/sub - 2/的阻水作用,热载流子降解增强

N. Shimoyama, K. Machida, K. Murase, T. Tsuchiya
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引用次数: 11

摘要

讨论了TEOS/O/sub - 3/-氧化物中水和/或硅烷醇对热载体降解的影响。随着TEOS/O/sub - 3/-氧化物介电层厚度的增加,热载流子劣化在mosfet中是一个严重的问题。这主要是由于热电子捕获的增强和界面陷阱的产生,这与TEOS/O/sub - 3/-氧化物中的水和/或硅烷醇扩散到栅极氧化物有关。指出在TEOS/O/sub - 3/-氧化物层下加装ECR(电子回旋共振)SiO/sub - 2/层,可将热载子损伤的耐受性提高到没有TEOS/O/sub - 3/-氧化物层的mosfet水平。
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Enhanced hot-carrier degradation due to water in TEOS/O/sub 3/-oxide and water blocking effect of ECR-SiO/sub 2/
The effect of water and/or silanols in TEOS/O/sub 3/-oxide on hot-carrier degradation is discussed. Hot-carrier degradation in MOSFETs is a serious problem as the thickness of the TEOS/O/sub 3/-oxide interlayer dielectric increases. This results mainly from enhanced hot-electron trapping and also from interface-trap generation, which are related to water and/or silanols in TEOS/O/sub 3/-oxide diffusing into the gate oxide. It is pointed out that by applying an ECR (electron cyclotron resonance) SiO/sub 2/ layer under the TEOS/O/sub 3/-oxide layer, tolerance against hot-carrier damage is improved to the level of MOSFETs without the TEOS/O/sub 3/-oxide layer.<>
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