用升华法在SiC和AlN衬底上生长AlN块状单晶

I. Nagai, Tomohisa Kato, Tomonori Miura, Hiroyuki Kamata, K. Naoe, K. Sanada, H. Okumura
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引用次数: 2

摘要

利用升华法在6H-SiC(0001)衬底上成功生长出直径达45 mm、厚度达10 mm的氮化铝(AlN)块状单晶。此外,在AlN(0001)衬底上高温同质外延生长的AlN达到了200μm/h的高生长速率。拉曼光谱结果表明,生长的AlN单晶为Wurtzite-2H型结构,且不含杂质相。在异质外延和同质外延的AlN块体单晶生长中,随着晶体沿生长方向厚度的增加,晶体顶部的质量得到改善:在异质外延和同质外延生长中,在厚度为8 mm和2 mm时,分别达到了7 × 104 cm−2和1 × 104 cm−2的低蚀刻坑密度。
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AlN bulk single crystal growth on SiC and AlN substrates by sublimation method
Aluminum nitride (AlN) bulk single crystals up to 45 mm in diameter and 10 mm in thickness have been successfully grown on 6H-SiC(0001) substrates by the sublimation method. Moreover, high growth rate of 200μm/h has been achieved by high temperature homo-epitaxial AlN growth on AlN(0001) substrate. The Raman spectrum indicates that the polytype of the grown AlN single crystals is a Wurtzite-2H type structure, and the crystals do not include any impurity phases. In both the hetero- and homo-epitaxial AlN bulk single crystal growth, the quality at the top of the crystal improves as the crystal thickness increases along the <0001> direction during the growth: low etch pit density 7 × 104 cm−2 and 1 × 104 cm−2 have been achieved at a thickness of 8 mm and 2 mm in the hetero- and homo-epitaxial growth, respectively.
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