氧暴露对硅场发射极阵列形式的影响

R. Asadi, T. Zheng, G. Rughoobur, R. Bhattacharya, J. Browning, A. Akinwande, B. Gnade
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引用次数: 0

摘要

研究了氧暴露对硅场发射极阵列(Si-FEA)性能的影响。在将10 - 7 Torr分压O2引入腔室之前,在6×10−10 Torr条件下,在1000V直流阳极和45V直流栅极电压下,对50×50硅场发射阵列进行了测试。结果表明,每Langmuir O2暴露,阳极电流降解率约为0.1%。本研究可为Si-FEAs的真空封装要求提供指导。
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Effect of O2 Exposure on Silicon Field Emitter Arrays Style
The impact of Oxygen (O2) exposure on Silicon Field Emitter Arrays (Si-FEA) was studied. A 50×50 array of Silicon field emitters was tested at 1000V DC anode and 45V DC gate voltage in 6×10−10 Torr before 10–7 Torr partial pressure of O2 was introduced into the chamber. The results indicate that the anode current degradation rate is approximately 0.1 percent per Langmuir of O2 exposure. This study can provide guidelines for the vacuum packaging requirements of Si-FEAs.
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