利用异质外延横向过度生长在硅上局部生长的绝缘体上锗结构

J. Nam, W. Jung, J. Shim, T. Ito, Y. Nishi, J. Park, K. Saraswat
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引用次数: 1

摘要

介绍了一种与CMOS兼容的在硅衬底上局部实现绝缘体(GOI)结构上制造锗(Ge)的技术。在(100)晶硅衬底上,二氧化硅(SiO2)被热生长。然后,通过局部蚀刻SiO2以显示Si表面来定义Ge的生长窗口。通过高温氢气(H2)退火的多个步骤,实现了锗的外延生长。生长的Ge晶体填满生长窗口后,横向生长,最终与相邻的Ge生长窗口合并。这样就得到了位于SiO2上的结晶Ge。化学机械抛光(CMP)用于表面平整,湿法蚀刻用于控制GOI膜厚度。
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Germanium on insulator (GOI) structure locally grown on silicon using hetero epitaxial lateral overgrowth
A CMOS compatible technique for fabricating germanium (Ge) on insulator (GOI) structure that is locally implemented on silicon (Si) substrate is demonstrated. On a (100) crystalline Si substrate, silicon dioxide (SiO2) is thermally grown. Then growth window for Ge is defined by locally etching down the SiO2 to reveal the Si surface. Ge is grown epitaxially with multiple steps of high temperature hydrogen (H2) annealing. After growing Ge crystals fill the growth window, the growth proceeds laterally and, finally coalesces with the neighbouring Ge growth window. Thus crystalline Ge sitting on SiO2 is achieved. Chemical mechanical polishing (CMP) is used to planarize the surface, and wet etching is done to control the GOI film thickness.
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