有机半导体应变传感器

Soyoun Jung, T. Jackson
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引用次数: 10

摘要

在本文中,作者报告了第一个使用有机半导体作为有源元件的应变传感器。作者使用掺杂有机半导体作为低杨氏模量应变传感器的有源元件。传感器的横截面如图所示。对于这些传感器,通过热蒸发将2nm厚的Ti和20nm厚的Au沉积在50微米厚的聚酰亚胺衬底上,并进行图案化以形成传感器电极和布线。然后,再次通过热蒸发沉积50 nm厚的并五苯层。然后将并五苯层通过暴露于1%的氯化铁溶液中进行p型掺杂。然后使用聚乙烯醇光刻步骤和氧反应离子蚀刻对掺杂的并五苯薄膜进行图案化。用于制造有机应变传感器的最高工艺温度为110摄氏度
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Organic semiconductor strain sensors
In this paper, the authors report the first strain sensors using an organic semiconductor as the active element. The authors have used a doped organic semiconductor as the active element for low Young's modulus strain sensors. The sensor cross-section is shown. For these sensors 2 nm thick Ti and 20 nm thick Au were deposited on 50 micron thick polyimide substrates by thermal evaporation and patterned to form sensor electrodes and wiring. Next, a 50 nm thick pentacene layer was deposited, again by thermal evaporation. The pentacene layer was then doped p-type by exposure to a 1 % solution of ferric chloride in water. The doped pentacene film was then patterned using an aqueous polyvinyl alcohol photolithography step and oxygen reactive ion etching. The maximum process temperature used to fabricate the organic strain sensors is 110 degC
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