System scaling for intelligent ubiquitous computing

Wafer based 3D×3D system scaling revolutionizes machine learning (ML) and artificial intelligence (AI) as well as mobile computing. It may trigger a big bang in intelligent ubiquitous computing. 3D CMOS scaling continues with many challenges and opportunities for relentless innovation in materials, processes, devices, circuits, design, EDA, computing architectures, algorithms, and software. 3D stacking and heterogeneous system integration, e.g., CoWoS® and InFO, not only augments but also amplifies the benefits of 3D CMOS logic, 3D memory, integrated specialty technologies and 3D sensors for intelligent ubiquitous computing. The virtuous cycles of 3D×3D system scaling innovation may expand like a galaxy or universe. The aggregate transistor count in a 3D×3D sub-system may reach the equivalent of human brain in the 2020s to provide brain-like augmented intelligence.