多芯片技术将在未来十年释放计算性能的提升

Lisa T. Su, S. Naffziger, M. Papermaster
{"title":"多芯片技术将在未来十年释放计算性能的提升","authors":"Lisa T. Su, S. Naffziger, M. Papermaster","doi":"10.1109/IEDM.2017.8268306","DOIUrl":null,"url":null,"abstract":"Datacenter and high-performance computing capabilities have continued their exponential improvements in performance over the prior decade, driven by the proliferation of devices and data through the internet of things (IoT), and new applications in the enterprise and cloud. This trend will continue over the next decade as the demand for compute performance continues to grow with exabytes of data being created daily and new use models incorporating machine learning and artificial intelligence become more prevalent. As Moore's Law has slowed in recent years, numerous techniques including system, architectural and software innovation have been used to extend the high-performance processor performance improvements. We examine these techniques and demonstrate that although some of these will continue, new innovations are needed especially at the system level to continue the performance trend over the next decade. We believe that multi-chip technologies and system level innovations are key to unlocking the performance gains in computing over the next decade.","PeriodicalId":412333,"journal":{"name":"2017 IEEE International Electron Devices Meeting (IEDM)","volume":"117 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"26","resultStr":"{\"title\":\"Multi-chip technologies to unleash computing performance gains over the next decade\",\"authors\":\"Lisa T. Su, S. Naffziger, M. Papermaster\",\"doi\":\"10.1109/IEDM.2017.8268306\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Datacenter and high-performance computing capabilities have continued their exponential improvements in performance over the prior decade, driven by the proliferation of devices and data through the internet of things (IoT), and new applications in the enterprise and cloud. This trend will continue over the next decade as the demand for compute performance continues to grow with exabytes of data being created daily and new use models incorporating machine learning and artificial intelligence become more prevalent. As Moore's Law has slowed in recent years, numerous techniques including system, architectural and software innovation have been used to extend the high-performance processor performance improvements. We examine these techniques and demonstrate that although some of these will continue, new innovations are needed especially at the system level to continue the performance trend over the next decade. We believe that multi-chip technologies and system level innovations are key to unlocking the performance gains in computing over the next decade.\",\"PeriodicalId\":412333,\"journal\":{\"name\":\"2017 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"117 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"26\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2017.8268306\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2017.8268306","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 26

摘要

在过去十年中,由于物联网(IoT)设备和数据的激增,以及企业和云中的新应用,数据中心和高性能计算能力的性能继续呈指数级增长。这一趋势将在未来十年持续下去,因为对计算性能的需求将继续增长,每天创建的数据量将达到艾字节,结合机器学习和人工智能的新使用模型将变得更加普遍。随着近年来摩尔定律的发展放缓,包括系统、架构和软件创新在内的许多技术被用于扩展高性能处理器的性能改进。我们对这些技术进行了研究,并证明尽管其中一些技术将继续存在,但要在未来十年继续保持性能趋势,还需要新的创新,特别是在系统级别。我们相信,多芯片技术和系统级创新是未来十年计算性能提升的关键。
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Multi-chip technologies to unleash computing performance gains over the next decade
Datacenter and high-performance computing capabilities have continued their exponential improvements in performance over the prior decade, driven by the proliferation of devices and data through the internet of things (IoT), and new applications in the enterprise and cloud. This trend will continue over the next decade as the demand for compute performance continues to grow with exabytes of data being created daily and new use models incorporating machine learning and artificial intelligence become more prevalent. As Moore's Law has slowed in recent years, numerous techniques including system, architectural and software innovation have been used to extend the high-performance processor performance improvements. We examine these techniques and demonstrate that although some of these will continue, new innovations are needed especially at the system level to continue the performance trend over the next decade. We believe that multi-chip technologies and system level innovations are key to unlocking the performance gains in computing over the next decade.
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