{"title":"利用三维场提取得到的互耦参数增强电路仿真","authors":"N. Moonen, F. Buesink, F. Leferink","doi":"10.1109/APEMC.2016.7523002","DOIUrl":null,"url":null,"abstract":"Predicting high frequency behavior of systems with equivalent circuit simulations that are including component self-parasitic effects are not sufficiently accurate anymore. Mutual coupling, which is highly dependent on component/traces placement and orientation, has to be included in circuit models. Predicting the impact can be performed using 3D electromagnetic field simulations, but these are complex and time consuming. This paper suggest extracting the mutual coupling parameters from a parametric 3D model. The lumped elements, which represent the mutual coupling via the electromagnetic field, are back-annotated in the equivalent circuit model. Then circuit simulations can be performed very fast and the impact of the mutual coupling can be determined.","PeriodicalId":358257,"journal":{"name":"2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)","volume":"118 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Enhanced circuit simulation using mutual coupling parameters obtained via 3D field extraction\",\"authors\":\"N. Moonen, F. Buesink, F. Leferink\",\"doi\":\"10.1109/APEMC.2016.7523002\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Predicting high frequency behavior of systems with equivalent circuit simulations that are including component self-parasitic effects are not sufficiently accurate anymore. Mutual coupling, which is highly dependent on component/traces placement and orientation, has to be included in circuit models. Predicting the impact can be performed using 3D electromagnetic field simulations, but these are complex and time consuming. This paper suggest extracting the mutual coupling parameters from a parametric 3D model. The lumped elements, which represent the mutual coupling via the electromagnetic field, are back-annotated in the equivalent circuit model. Then circuit simulations can be performed very fast and the impact of the mutual coupling can be determined.\",\"PeriodicalId\":358257,\"journal\":{\"name\":\"2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)\",\"volume\":\"118 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-05-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APEMC.2016.7523002\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEMC.2016.7523002","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Enhanced circuit simulation using mutual coupling parameters obtained via 3D field extraction
Predicting high frequency behavior of systems with equivalent circuit simulations that are including component self-parasitic effects are not sufficiently accurate anymore. Mutual coupling, which is highly dependent on component/traces placement and orientation, has to be included in circuit models. Predicting the impact can be performed using 3D electromagnetic field simulations, but these are complex and time consuming. This paper suggest extracting the mutual coupling parameters from a parametric 3D model. The lumped elements, which represent the mutual coupling via the electromagnetic field, are back-annotated in the equivalent circuit model. Then circuit simulations can be performed very fast and the impact of the mutual coupling can be determined.