基于ETOX的闪存的可靠性性能

G. Verma, N. Mielke
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引用次数: 73

摘要

研究了基于单晶体管浮栅存储单元的64k闪存的可靠性性能。在程序/擦除循环之前,这些存储器的可靠性性能与UV eprom相匹配。循环通常不会引入某些eeprom常见的与缺陷相关的故障。然而,它可能会加剧UV EPROM固有的两种不稳定性(固有电荷损失和直流程序干扰机制)。经验表明,这些都是在循环的擦除步骤中注入孔所引起的相关影响。在擦除过程中,源与衬底之间的高电场会产生这些空穴。通道热电子注入,对于编程,在观察到的退化中没有显著的作用。这些循环效应可以通过在闪速电池中加入额外的余量来解决。通过这种单元优化,即使经过数百次程序/擦除周期,这些存储器的可靠性也与传统的UV eprom相当。
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Reliability performance of ETOX based flash memories
The reliability performance of a 64 K flash memory based on a single-transistor, floating-gate memory cell is considered. The reliability performance of these memories, before program/erase cycling, matches that of UV EPROMs. Cycling generally does not introduce defect-related failures common to some EEPROMs. However, it may aggravate two intrinsic instabilities found in the UV EPROM (intrinsic charge loss and the DC program disturb mechanism). Experience shows that these are related effects caused by injection of holes during the erase step of the cycle. High source-to-substrate electric fields, during erase, generate these holes. Channel hot electron injection, for programming, plays no significant role in the observed degradation. These cycling effects can be addressed through incorporation of additional margin into the flash cell. Through such cell optimization, the reliability of these memories is made equivalent to that of conventional UV EPROMs, even after hundreds of program/erase cycles.<>
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