{"title":"GaN高压hemt中动态导通电阻的机制","authors":"D. Jin, Jesus A. del Alamo","doi":"10.1109/ISPSD.2012.6229089","DOIUrl":null,"url":null,"abstract":"We have developed a new methodology to study the dynamic ON-resistance (RON) of high-voltage GaN High-Electron-Mobility Transistors (HEMTs). With this technique, we have investigated dynamic RON transients over a time span of 11 decades. In OFF to ON time transients, we observe a fast release of trapped electrons through a temperature-independent tunneling process. We attribute this to border traps at the AlGaN barrier/AlN spacer interface. Over a longer time scale, we observe conventional thermally activated electron detrapping from traps at the surface of the device or inside the AlGaN barrier. These findings provide a path for power switching device engineering with minimum dynamic RON.","PeriodicalId":371298,"journal":{"name":"2012 24th International Symposium on Power Semiconductor Devices and ICs","volume":"103 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"92","resultStr":"{\"title\":\"Mechanisms responsible for dynamic ON-resistance in GaN high-voltage HEMTs\",\"authors\":\"D. Jin, Jesus A. del Alamo\",\"doi\":\"10.1109/ISPSD.2012.6229089\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have developed a new methodology to study the dynamic ON-resistance (RON) of high-voltage GaN High-Electron-Mobility Transistors (HEMTs). With this technique, we have investigated dynamic RON transients over a time span of 11 decades. In OFF to ON time transients, we observe a fast release of trapped electrons through a temperature-independent tunneling process. We attribute this to border traps at the AlGaN barrier/AlN spacer interface. Over a longer time scale, we observe conventional thermally activated electron detrapping from traps at the surface of the device or inside the AlGaN barrier. These findings provide a path for power switching device engineering with minimum dynamic RON.\",\"PeriodicalId\":371298,\"journal\":{\"name\":\"2012 24th International Symposium on Power Semiconductor Devices and ICs\",\"volume\":\"103 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-06-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"92\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 24th International Symposium on Power Semiconductor Devices and ICs\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.2012.6229089\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 24th International Symposium on Power Semiconductor Devices and ICs","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2012.6229089","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 92
摘要
我们开发了一种新的方法来研究高压氮化镓高电子迁移率晶体管的动态导通电阻(RON)。使用这种技术,我们已经研究了11年时间跨度内的动态RON瞬态。在OFF - to - ON时间瞬态中,我们观察到捕获电子通过与温度无关的隧道过程快速释放。我们将其归因于AlGaN势垒/AlN间隔层界面的边界陷阱。在更长的时间尺度上,我们观察到传统的热激活电子从器件表面或AlGaN势垒内部的陷阱中脱出。这些发现为动态RON最小的功率开关器件工程提供了一条途径。
Mechanisms responsible for dynamic ON-resistance in GaN high-voltage HEMTs
We have developed a new methodology to study the dynamic ON-resistance (RON) of high-voltage GaN High-Electron-Mobility Transistors (HEMTs). With this technique, we have investigated dynamic RON transients over a time span of 11 decades. In OFF to ON time transients, we observe a fast release of trapped electrons through a temperature-independent tunneling process. We attribute this to border traps at the AlGaN barrier/AlN spacer interface. Over a longer time scale, we observe conventional thermally activated electron detrapping from traps at the surface of the device or inside the AlGaN barrier. These findings provide a path for power switching device engineering with minimum dynamic RON.