MQUAD微电子封装的热表征方法

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 1993-02-02 DOI:10.1109/STHERM.1993.225316

B. Guenin, D. Mahulikar

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引用次数: 11

摘要

描述了用于表征MQUAD封装热性能的实验和数学建模技术。所表征的情况是自然对流，封装附在测试板上。所描述的技术利用了MQUAD包的独特构造，以实现相对简单的执行。由于其内部热阻低和与电路板的有效热耦合，MQUAD封装的热行为主要由对流换热系数和电路板的导热率决定。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Methodology for the thermal characterization of the MQUAD microelectronic package

Experimental and mathematical modeling techniques which were developed to characterize the thermal performance of MQUAD packages are described. The situation characterized is one of natural convection, with the package attached to a test board. The techniques described take advantage of the unique construction of the MQUAD package in order to achieve relative simplicity in their execution. Due to its low internal thermal resistance and efficient thermal coupling to the circuit board, the thermal behavior of the MQUAD package is dominated by the convective heat transfer coefficient and the thermal conductivity of the circuit board.<>

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[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium

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