用于多级电源的层压板嵌入式多模态能量采集器

Jorge A. Caripidis Troccola, Sweta Gupta, Maxence Carvalho, S. B. Venkatakrishnan, P. Raj, J. Volakis
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引用次数: 0

摘要

提出并演示了一种独特的多模态3D电源封装概念,用于同时从RF,太阳能和TEG中收集能量。关键创新有五个方面:1)RF和solar-TEG组件组件的3D垂直堆叠与基板嵌入,以实现TEG的高功率,同时还减少了整体模块厚度。2)用于射频功率采集的高增益线性天线阵列。3)从模块到面板的可重新安装的夹紧模糊按钮组件,便于操作人员拆卸和重新组装,使堆栈具有模块化和可修复性。4) 48 V和1.5 V同时收获。通过同时采集多电压域,可以通过选择性地消除某些电压变换器来简化电源结构。5)玻璃外壳,增加热梯度和输出功率。3D和嵌入式技术可扩展到高功率电网和低功率可穿戴设备和物联网应用,与RF的其他收集模式集成,使其成为一个创新的电力收集平台。
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Laminate-Embedded Multimodal Energy Harvester for Multilevel Power Supply
A unique, multimodal 3D power packaging concept for simultaneous energy harvesting from RF, Solar, and TEG is proposed and demonstrated. The key innovations are five-fold: 1) 3D vertical stacking with substrate-embedding of RF and solar-TEG module assembly to achieve high power from TEG, while also reducing the overall module thickness. 2) High-gain linear antenna arrays for RF power harvesting. 3) Remateable clamped fuzz-button assembly from the module to the panel for easy removal and re-assembly by the operator, giving modularity and reparability to the stack. 4) Simultaneous 48 V and 1.5 V harvesting. By simultaneously harvesting multi-voltage domains, the power supply architecture can be simplified by selectively eliminating certain voltage converters. 5) Glass encasing for increased thermal gradient and output power. The 3D and embedded technology are scalable to both high power grid and low power wearable and IoT applications, integrated with other harvesting modes from RF, making it an innovative platform for power harvesting.
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