{"title":"通孔和表面安装陶瓷电容器的焊接轮廓优化","authors":"R. Jano, A. Fodor","doi":"10.1109/ISSE.2014.6887586","DOIUrl":null,"url":null,"abstract":"The paper examines the feasibility of using vapour phase or infrared reflow soldering technologies for multi-layer ceramic chip (MLCC) and disk ceramic capacitors by employing the pin-in-paste technology. During practical experiments recommendations are made for optimizing the thermal profiles used when soldering there types of components in order to minimize the drift in the capacitance and ESR values of these types of capacitors.","PeriodicalId":375711,"journal":{"name":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Soldering profile optimization for through-hole and surface mounted ceramic capacitors\",\"authors\":\"R. Jano, A. Fodor\",\"doi\":\"10.1109/ISSE.2014.6887586\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper examines the feasibility of using vapour phase or infrared reflow soldering technologies for multi-layer ceramic chip (MLCC) and disk ceramic capacitors by employing the pin-in-paste technology. During practical experiments recommendations are made for optimizing the thermal profiles used when soldering there types of components in order to minimize the drift in the capacitance and ESR values of these types of capacitors.\",\"PeriodicalId\":375711,\"journal\":{\"name\":\"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-05-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2014.6887586\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2014 37th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2014.6887586","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Soldering profile optimization for through-hole and surface mounted ceramic capacitors
The paper examines the feasibility of using vapour phase or infrared reflow soldering technologies for multi-layer ceramic chip (MLCC) and disk ceramic capacitors by employing the pin-in-paste technology. During practical experiments recommendations are made for optimizing the thermal profiles used when soldering there types of components in order to minimize the drift in the capacitance and ESR values of these types of capacitors.
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