{"title":"新的3D ic供电方案,最大限度地减少高速I/ o的同时开关噪声","authors":"D. C. Zhang, M. Swaminathan, S. Huh","doi":"10.1109/EPEPS.2012.6457849","DOIUrl":null,"url":null,"abstract":"Simultaneous switching noise is a detrimental issue in high speed digital systems. In this paper, we utilize power transmission line based design and current steering to minimize power supply noise, eye height and jitter penalties.","PeriodicalId":188377,"journal":{"name":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","volume":"56 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"New power delivery scheme for 3D ICs to minimize simultaneous switching noise for high speed I/Os\",\"authors\":\"D. C. Zhang, M. Swaminathan, S. Huh\",\"doi\":\"10.1109/EPEPS.2012.6457849\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Simultaneous switching noise is a detrimental issue in high speed digital systems. In this paper, we utilize power transmission line based design and current steering to minimize power supply noise, eye height and jitter penalties.\",\"PeriodicalId\":188377,\"journal\":{\"name\":\"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems\",\"volume\":\"56 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2012.6457849\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2012.6457849","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
New power delivery scheme for 3D ICs to minimize simultaneous switching noise for high speed I/Os
Simultaneous switching noise is a detrimental issue in high speed digital systems. In this paper, we utilize power transmission line based design and current steering to minimize power supply noise, eye height and jitter penalties.