面向物联网和5G应用的双向SiP异构集成

Mike Tsai, Ryan Chiu, Ming-fan Tsai, Eric He, Erico Yang, Tim Chang, Frank Chu, J. Chen
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引用次数: 5

摘要

双面SiP是采用双面SMT技术和双面成型来缩小整体模块尺寸的热封装解决方案。封装尺寸的计算可以减少40%以上的PCB放置面积从8 × 8mm到6 × 6mm。从模块级翘曲性能和散热性能的角度出发,通过仿真和实验,包括不同成型材料选择DOE的成型工艺研究,验证了双面SiP翘曲性能。双侧SiP优势,简化PKG I/O计数(在便携式PMIC基础上减少10%),提高电源效率,降低噪声排放。从电气集成的角度来看,由于信号传输路径较短,获得了较好的电气性能(SI & PI)比其他并排倒装芯片基架结构。从热学性能来看,高热溶液可以改善$\ mathm {24}\sim \ mathm{38}\%$。双面SiP模块可以提供先进的解决方案,以满足5G和物联网营销对模块尺寸、成本、性能和上市时间的要求。本文的性能验证将进行仿真和测量。可靠性测试验证包括TCT、HTSL和u-HAST(温度循环测试、高温储存测试、无偏置HAST)结果作为对双面SiP结构的验证。最后,本文给出了双向SiP结构和未来5G和物联网设备应用的可行性数据。
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Heterogeneous Integration of Double Side SiP for IoT and 5G Application
Double Side SiP is hot packaging solution by using double side SMT technology and dual side molding to shrink the overall module size. The calculation of package size can be reduce over 40% PCB placement area from 8 x 8mm to 6 x 6mm. Based on module level warpage and thermal dissipation performance point of view, the simulation and experiment including the molding process study with difference molding compound selection DOE to verify Double Side SiP warpage performance. The advantage of Double Side SiP, simplify PKG I/O Count (10% reduction based on PMIC of portable), to improve power supply efficiency and reduce noise emission. From electrical integration point of view, due to shorter signal transmission path to get good electrical performance (SI & PI) than other side by side flip chip base structure. From thermal performance, high thermal solution can be improved $\mathrm{24}\sim \mathrm{38}\%$. The Double Side SiP module can provide an advanced solution to address the module size, cost, performance, and time-to-market requirement for 5G and IoT marketing. The performance verification in this paper will proceed simulation and measurement. The reliability testing verification was including the TCT, HTSL and u-HAST (Temperature Cycle Test, High Temperature Storage Test, un-bias HAST) results as a verification for Double Side SiP structure. Finally, this paper have Double Side SiP structure and feasibility data for future 5G and IoT devices application.
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Magnetically Actuated Test Method for Interfacial Fracture Reliability Assessment nSiP(System in Package) Platform for various module packaging applications IEEE 71st Electronic Components and Technology Conference [Title page] Evaluation of Low-k Integration Integrity Using Shear Testing on Sub-30 Micron Micro-Cu Pillars CoW Package Solution for Improving Thermal Characteristic of TSV-SiP for AI-Inference
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