垂直InAs-Si异质结隧道场效应晶体管的制备

H. Schmid, K. Moselund, M. Bjork, M. Richter, H. Ghoneim, C. Bessire, H. Riel
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引用次数: 26

摘要

作为隧道场效应晶体管(tfet)工作的门控p-i-n二极管[1]最近引起了人们的广泛关注,因为它比传统的mosfet具有潜在的优势。与mosfet相比,它们预计具有更低的断开电流,并且在更低的电源电压下工作。不幸的是,使用硅、锗及其合金等材料,这些承诺很难实现。然而,最近使用低带隙III-V (InGaAs)材料体系获得了令人鼓舞的实验结果[2,3],提供了更高的隧穿概率。本文报道了以InAs为低带隙源的III-V / Si异质结tfet的制备和电学特性的初步结果。这种材料组合保持了硅作为通道、漏极和衬底材料的优点,正如[4]中提出的那样。
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Fabrication of vertical InAs-Si heterojunction tunnel field effect transistors
Gated p-i-n diodes operating as tunnel field effect transistors (TFETs) [1] are recently attracting much attention because of potential benefits over conventional MOSFETs. They are expected to have lower off-current, and operate at lower supply voltage compared to MOSFETs. Unfortunately, these promises are very difficult to realize using materials like Si, Ge and its alloys. However, encouraging experimental results were recently obtained using lower bandgap III–V (InGaAs) material systems [2, 3] offering higher tunneling probabilities. Here we report first results on the fabrication and electrical characterization of III–V / Si heterojunction TFETs with InAs as low bandgap source. This material combination maintains the advantages of Si as channel, drain and substrate material as proposed in [4].
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