Thomas-Michael Winkel, L. S. Dutta, Hartmut Grabinski
{"title":"基于高频s参数测量的芯片上损耗线特性阻抗的精确测定","authors":"Thomas-Michael Winkel, L. S. Dutta, Hartmut Grabinski","doi":"10.1109/MCMC.1996.510793","DOIUrl":null,"url":null,"abstract":"A very accurate, novel determination of the characteristic impedance of interconnects on semiconducting substrates has been developed. The method is based upon high frequency, S-parameter measurements of two transmission lines of different lengths. The influence of the contact structures of the measurement probes are taken into account with the help of three additional measurements. The mathematical background of the method is presented. A comparison of the results obtained from measurements and from calculations is given and shows an excellent agreement.","PeriodicalId":126969,"journal":{"name":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1996-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"30","resultStr":"{\"title\":\"An accurate determination of the characteristic impedance of lossy lines on chips based on high frequency S-parameter measurements\",\"authors\":\"Thomas-Michael Winkel, L. S. Dutta, Hartmut Grabinski\",\"doi\":\"10.1109/MCMC.1996.510793\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A very accurate, novel determination of the characteristic impedance of interconnects on semiconducting substrates has been developed. The method is based upon high frequency, S-parameter measurements of two transmission lines of different lengths. The influence of the contact structures of the measurement probes are taken into account with the help of three additional measurements. The mathematical background of the method is presented. A comparison of the results obtained from measurements and from calculations is given and shows an excellent agreement.\",\"PeriodicalId\":126969,\"journal\":{\"name\":\"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-02-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"30\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1996.510793\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1996.510793","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An accurate determination of the characteristic impedance of lossy lines on chips based on high frequency S-parameter measurements
A very accurate, novel determination of the characteristic impedance of interconnects on semiconducting substrates has been developed. The method is based upon high frequency, S-parameter measurements of two transmission lines of different lengths. The influence of the contact structures of the measurement probes are taken into account with the help of three additional measurements. The mathematical background of the method is presented. A comparison of the results obtained from measurements and from calculations is given and shows an excellent agreement.
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