故障隔离下的短故障分析

Z. Mai, M. Palaniappan, J. Chin, C. E. Soh, L.A. Knauss, E. Fleet
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引用次数: 4

摘要

将扫描超导量子干涉器件(SQUID)显微镜与实时x射线(RTX)显微镜和扫描声学显微镜(SAM)一起作为IC短路故障分析的故障隔离工具。在物理分析之前进行故障隔离。给出了故障隔离和物理分析的实验步骤和结果。
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Short failure analysis under fault isolation
Scanning superconducting quantum interference device (SQUID) microscopy, along with real time X-ray (RTX) microscopy and scanning acoustic microscopy (SAM), was used as a fault isolation tool for IC short circuit failure analysis. Fault isolation was carried out before physical analysis. Experimental procedures and results for both fault isolation and physical analysis are given in detail.
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