用于表征硅上静态和瞬态热现象的BIMOS二极管矩阵

B. Geeraerts, W. Van Petegem, W. Sansen
{"title":"用于表征硅上静态和瞬态热现象的BIMOS二极管矩阵","authors":"B. Geeraerts, W. Van Petegem, W. Sansen","doi":"10.1109/STHERM.1993.225325","DOIUrl":null,"url":null,"abstract":"A diode matrix has been designed and processed in SBIMOS technology in order to obtain a better understanding on the static temperature distributions and transient thermal phenomena in the silicon. The diode matrix is shown to be the perfect tool for determining thermal constants and temperature distributions on chip. This information can be used to evaluate the electro-thermal simulator and to provide designers with more practical information in designing temperature critical ICs, resulting in smaller power ICs for the same performance. Temperature-related problems on chip such as offset voltage due to temperature gradients and maximum allowable temperature can be adequately modeled and hence calculated.<<ETX>>","PeriodicalId":369022,"journal":{"name":"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-02-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A BIMOS diode matrix for the characterization of static and transient thermal phenomena on silicon\",\"authors\":\"B. Geeraerts, W. Van Petegem, W. Sansen\",\"doi\":\"10.1109/STHERM.1993.225325\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A diode matrix has been designed and processed in SBIMOS technology in order to obtain a better understanding on the static temperature distributions and transient thermal phenomena in the silicon. The diode matrix is shown to be the perfect tool for determining thermal constants and temperature distributions on chip. This information can be used to evaluate the electro-thermal simulator and to provide designers with more practical information in designing temperature critical ICs, resulting in smaller power ICs for the same performance. Temperature-related problems on chip such as offset voltage due to temperature gradients and maximum allowable temperature can be adequately modeled and hence calculated.<<ETX>>\",\"PeriodicalId\":369022,\"journal\":{\"name\":\"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-02-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.1993.225325\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.1993.225325","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

为了更好地了解硅中的静态温度分布和瞬态热现象,设计了二极管矩阵,并采用shimos技术对其进行了加工。二极管矩阵被证明是确定芯片上的热常数和温度分布的完美工具。这些信息可用于评估电热模拟器,并为设计人员在设计温度临界ic时提供更实用的信息,从而在相同性能下实现更小功耗的ic。芯片上的温度相关问题,如由温度梯度和最大允许温度引起的偏置电压,可以充分建模并因此计算
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
A BIMOS diode matrix for the characterization of static and transient thermal phenomena on silicon
A diode matrix has been designed and processed in SBIMOS technology in order to obtain a better understanding on the static temperature distributions and transient thermal phenomena in the silicon. The diode matrix is shown to be the perfect tool for determining thermal constants and temperature distributions on chip. This information can be used to evaluate the electro-thermal simulator and to provide designers with more practical information in designing temperature critical ICs, resulting in smaller power ICs for the same performance. Temperature-related problems on chip such as offset voltage due to temperature gradients and maximum allowable temperature can be adequately modeled and hence calculated.<>
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Thermal resistance, thermomechanical stress and thermal cycling endurance of silicon chips bonded with adhesives Thermal and electrical resistances of bolted joints between plates of unequal thickness Electrically measuring the peak channel temperature of power GaAs MESFET Experimental characterization of board conduction sheets Methodology for the thermal characterization of the MQUAD microelectronic package
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1