T. Winkel, M.F. Ktata, T. Ludwig, H. Schettler, H. Grabinski, E. Klink
{"title":"用s参数测量法确定与芯片测试线路结构相关的产品上与频率相关的传输线参数","authors":"T. Winkel, M.F. Ktata, T. Ludwig, H. Schettler, H. Grabinski, E. Klink","doi":"10.1109/EPEP.2003.1250008","DOIUrl":null,"url":null,"abstract":"The frequency dependent propagation constant, characteristic impedance as well as the R, L, C and G parameters are determined from on chip S-parameter measurements. The transmission line test structures are embedded in a multi layer test chip. Measurement limitations due to a non ideal chip environment are shown and discussed. Measured and simulated results show a very good agreement.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Determination of frequency dependent transmission line parameters on product related on chip test line structures using S-parameter measurements\",\"authors\":\"T. Winkel, M.F. Ktata, T. Ludwig, H. Schettler, H. Grabinski, E. Klink\",\"doi\":\"10.1109/EPEP.2003.1250008\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The frequency dependent propagation constant, characteristic impedance as well as the R, L, C and G parameters are determined from on chip S-parameter measurements. The transmission line test structures are embedded in a multi layer test chip. Measurement limitations due to a non ideal chip environment are shown and discussed. Measured and simulated results show a very good agreement.\",\"PeriodicalId\":254477,\"journal\":{\"name\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2003.1250008\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250008","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Determination of frequency dependent transmission line parameters on product related on chip test line structures using S-parameter measurements
The frequency dependent propagation constant, characteristic impedance as well as the R, L, C and G parameters are determined from on chip S-parameter measurements. The transmission line test structures are embedded in a multi layer test chip. Measurement limitations due to a non ideal chip environment are shown and discussed. Measured and simulated results show a very good agreement.
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