两种不同衬底亚微米HEMT的差分电导分析研究

A. Deyasi, Biplab Sen, G. Saha, A. Sarkar
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引用次数: 1

摘要

分析了亚微米HEMT的差分电导在不同结构参数和寄生效应下的漏极偏置函数。对硅和蓝宝石两种不同的衬底器件进行了仿真,并对VGS提供最大跨导的结构参数进行了比较研究。同时求解泊松方程和载流子密度方程,得到漏极电流的变化,并通过边界条件引入寄生效应,以得到实际结果。结果表明,在较宽的水平偏置范围内,阈值电压对蓝宝石基器件的影响可以忽略不计。纳米通道长度提供了几乎恒定的电导分布,量级无关紧要。
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Analytical Investigation of Differential Conductance in Submicron HEMT with Two Different Substrates
Differential conductance of submicron HEMT is analytically investigated as a function of drain bias for different structural parameters and parasitic effects. Simulation is carried out for two different substrate based devices, Si and sapphire, and comparative study is carried out for those structural parameters at which VGS provides maximum transconductance. Poisson's equation and carrier density equations are simultaneously solved to get drain current variations and parasitic effects are invoked through boundary conditions for realistic results. Result speaks that effect of threshold voltage is negligible on sapphire based device over a wider range of horizontal bias. Nanometric channel length provides almost constant conductance profile with insignificant magnitude.
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