Study of the die position accuracy in the fabrication process of a die first type FO-PLP

Die position accuracy is one of the important topics of the fabrication processes of die first fan out packages (FO-PKG). In this research, the die position accuracy and the compensation were studied by the combined approach of the sample preparation and the numerical calculation. As a result, the flow didn’t influence on the die shift significantly and the die shift could be estimated by the component material properties, which were the curing shrinkage of the EMC (epoxy molding compound), and the CTE (coefficient of thermal expansions) and the elastic moduli of the EMC, the TBA (temporary bonding adhesive) and the support. The value of the thermal die shift can be predicted by the developed formulasm. The pre-shift die mouting using the predicted value singnificanltly can suppress the thermal die shift.