高可靠性耦合器的封装

D.R. Young, A. Morrow, K. Gadkaree, D. E. Quinn
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引用次数: 1

摘要

通过单一光纤线路的电话和计算机数据通信量的增加,以及减少冗余以降低资本成本的愿望,导致地面和海底市场对高可靠性组件的需求增加。作者描述了一种用于开发适用于海下应用的超高可靠性耦合器的多包层耦合器工艺。为了实现所需的光学和机械稳定性,需要采用新的低膨胀复合材料包装和LCP外壳的新封装工艺。对耦合器和封装材料进行了广泛的热学和机械测试,预测这些组件在计划的27年使用寿命内具有优异的性能
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Packaging of high reliability couplers
The increased amount of telephony and computer data traffic over single optical fiber lines and the desire to reduce redundancy to decrease capital cost have led to an increased need for high reliability components both in terrestrial and submarine markets. The authors describe a multiclad coupler process which has been used to develop ultra-high reliability couplers suitable for undersea applications. A new packaging process using a new low expansion composite wrap and LCP housing was required to achieve the optical and mechanical stability required. Extensive thermal and mechanical tests of the couplers and packaging materials predict excellent performance over the planned 27 year lifetime of these components.<>
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