碳化硅器件和工艺的现状与未来

M. Ostling, H. Lee, M. Domeij, C. Zetterling
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引用次数: 3

摘要

碳化硅电子器件已经在一些应用领域商业化,如高压整流器和新兴的射频功率放大器。在过去的15年里,材料和设备质量都取得了非常迅速的进步,这对不久的将来的应用市场来说是非常令人鼓舞的。原型器件每年在所有器件类别中都有惊人的改进,晶圆质量也有显著提高。然而,材料缺陷问题仍然限制了经济可行的大面积高成品率器件的生产。本文综述了碳化硅器件工艺技术的进展,介绍了碳化硅器件的最新进展以及铁电场效应晶体管等新的应用领域
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Silicon carbide devices and processes - present status and future pers
Silicon carbide electronic devices are already commercially available in a few application areas such as high voltage rectifiers and emerging RF power amplifiers. Over the past 15 years a very rapid progress of both materials and device quality has been seen and is very encouraging for the near future application market. Prototype devices show amazing improvement each year in all device categories as well as a markedly improved wafer quality. However, materials defect issues are still limiting economically viable production of large area devices with high yield. In this paper a thorough review of progress in SiC device process technology and presents the state-of-the art SiC devices as well as new application areas such as ferroelectric field effect transistors
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